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US 2026/0198243 A1Published application
Methods for wafer level processing of optical devices with optical coating edge integrity
AssigneeViavi Solutions Inc.
InventorsAlexis Weckel, Georg Ockenfuss, Hung Xuan Nguyen
Life of this patent
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Abstract
A method may include cutting a plurality of grooves partially through a thickness of a wafer substrate, where the plurality of grooves have a first width. The method may include applying an optical coating layer on the wafer substrate and over the plurality of grooves to obtain a wafer structure, where dicing streets for the wafer structure align with the plurality of grooves. The method may include dicing the wafer structure along the dicing streets using dicing cuts having a second width less than the first width.
Claims20
A method, comprising:
- cutting a plurality of grooves partially through a thickness of a wafer substrate,
- wherein the plurality of grooves have a first width;
- applying an optical coating layer on the wafer substrate and over the plurality of grooves to obtain a wafer structure,
- wherein dicing streets for the wafer structure align with the plurality of grooves;
- and
- dicing the wafer structure along the dicing streets using dicing cuts having a second width less than the first width.
3 more elements
A method, comprising:
- partially dicing through a thickness of a wafer substrate to define a plurality of dicing lanes in the wafer substrate;
- applying, after partially dicing through the thickness of the wafer substrate, an optical coating layer on the wafer substrate to obtain a wafer structure;
- and
- fully dicing the wafer structure along the plurality of dicing lanes.
1 more element
A method, comprising:
- cutting a plurality of grooves partially through a thickness of a wafer substrate;
- applying an optical coating layer on the wafer substrate and over the plurality of grooves to obtain a wafer structure;
- and
- dicing the wafer structure along the plurality of grooves.
1 more element
Dependencies are inferred from the claim text.