H10P 14/47
Electrolytic deposition, i.e. electroplating
Official title: Electrolytic deposition, i.e. electroplating; Electroless plating
H10P14/47 (Electrolytic deposition, i.e. electroplating) appears on 1,600 US grants and 1,870 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,600
- Published applications
- 1,870
- Assignees
- 407
- Inventors
- 2,837
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 6 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 6 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 6 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 8 | 0 |
| 2000 | 25 | 0 |
| 2001 | 57 | 25 |
| 2002 | 80 | 107 |
| 2003 | 94 | 121 |
| 2004 | 81 | 169 |
| 2005 | 80 | 149 |
| 2006 | 72 | 135 |
| 2007 | 80 | 88 |
| 2008 | 51 | 56 |
| 2009 | 62 | 64 |
| 2010 | 61 | 54 |
| 2011 | 46 | 40 |
| 2012 | 35 | 71 |
| 2013 | 42 | 40 |
| 2014 | 39 | 57 |
| 2015 | 36 | 75 |
| 2016 | 75 | 107 |
| 2017 | 103 | 79 |
| 2018 | 57 | 76 |
| 2019 | 88 | 79 |
| 2020 | 69 | 65 |
| 2021 | 68 | 53 |
| 2022 | 29 | 46 |
| 2023 | 36 | 37 |
| 2024 | 34 | 29 |
| 2025 | 22 | 23 |
| 2026 | 7 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Paddle chamber with anti-splashing baffles4 Aug 2026US 12,698,568 B2APPLIED Materials.Inc.
- Electrodeposition of metals using an ionically resistive ionically permeable element or a shield spatially tailored to die-level patterns on a substrate7 Jul 2026US 12,674,246 B2Lam Research Corporation
- Semiconductor package and method23 Jun 2026US 12,666,979 B2Taiwan Semiconductor Manufacturing Company.Ltd
- High-speed 3D metal printing of semiconductor metal interconnects14 Apr 2026US 12,601,080 B2Lam Research Corporation
- Methods and apparatus for altering lithographic patterns to adjust plating uniformity10 Mar 2026US 12,571,119 B2APPLIED Materials.Inc.
- Method for controlled spalling of high fracture toughness materials1 Oct 2026US 2026/0305207 A1
- Automated switching between wafer pattern specific diffusers24 Sep 2026US 2026/0286561 A1APPLIED Materials.Inc.
- Electroplating apparatus17 Sep 2026US 2026/0275563 A1ACM Research (Shanghai) Inc.
- Method for filling cobalt into through vias of a semiconductor wafer10 Sep 2026US 2026/0271691 A1City University of Hong Kong
- Substrate liquid processing method and substrate liquid processing apparatus27 Aug 2026US 2026/0255892 A1Tokyo Electron Limited
Most cited
By later US patents
- Method and structure to improve reliability of copper interconnects562US 7,129,165 B2ASM Nutool, Inc. · 2006
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Film forming method, semiconductor device, manufacturing method thereof and substrate processing apparatus therefor470US 8,785,311 B2Tokyo Electron Limited · 2014
- Substrate processing apparatus469US 8,999,102 B2Tokyo Electron Limited · 2015