H10P 14/46
Using a liquid
Official title: using a liquid
H10P14/46 (Using a liquid) appears on 2,927 US grants and 3,401 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,927
- Published applications
- 3,401
- Assignees
- 711
- Inventors
- 4,954
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 5 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 7 | 0 |
| 1981 | 1 | 0 |
| 1982 | 5 | 0 |
| 1983 | 4 | 0 |
| 1984 | 4 | 0 |
| 1985 | 6 | 0 |
| 1986 | 5 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 7 | 0 |
| 1992 | 8 | 0 |
| 1993 | 11 | 0 |
| 1994 | 10 | 0 |
| 1995 | 6 | 0 |
| 1996 | 6 | 0 |
| 1997 | 9 | 0 |
| 1998 | 11 | 0 |
| 1999 | 17 | 0 |
| 2000 | 41 | 0 |
| 2001 | 86 | 45 |
| 2002 | 135 | 154 |
| 2003 | 152 | 194 |
| 2004 | 141 | 277 |
| 2005 | 132 | 271 |
| 2006 | 129 | 256 |
| 2007 | 144 | 194 |
| 2008 | 112 | 119 |
| 2009 | 128 | 125 |
| 2010 | 124 | 116 |
| 2011 | 107 | 96 |
| 2012 | 86 | 118 |
| 2013 | 79 | 72 |
| 2014 | 81 | 96 |
| 2015 | 75 | 148 |
| 2016 | 139 | 199 |
| 2017 | 177 | 158 |
| 2018 | 117 | 134 |
| 2019 | 138 | 144 |
| 2020 | 117 | 112 |
| 2021 | 119 | 94 |
| 2022 | 57 | 76 |
| 2023 | 60 | 58 |
| 2024 | 53 | 63 |
| 2025 | 40 | 47 |
| 2026 | 15 | 35 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electroless deposition process for semiconductor devices6 Oct 2026US 12,757,651 B2
- Substrate liquid processing method, and recording medium6 Oct 2026US 12,757,697 B2Tokyo Electron Limited
- Semiconductor device structure having a multi-layer conductive feature and method making the same11 Aug 2026US 12,707,965 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Paddle chamber with anti-splashing baffles4 Aug 2026US 12,698,568 B2APPLIED Materials.Inc.
- Electrodeposition of metals using an ionically resistive ionically permeable element or a shield spatially tailored to die-level patterns on a substrate7 Jul 2026US 12,674,246 B2Lam Research Corporation
- Method for controlled spalling of high fracture toughness materials1 Oct 2026US 2026/0305207 A1
- Method of forming electrically conductive lines with controlled coefficient of thermal expansion1 Oct 2026US 2026/0305280 A1Inpack Technologies - Limited Partnership
- Semiconductor Device Structure Having a Multi-Layer Conductive Feature and Method Making the Same1 Oct 2026US 2026/0305330 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Automated switching between wafer pattern specific diffusers24 Sep 2026US 2026/0286561 A1APPLIED Materials.Inc.
- Electroplating apparatus17 Sep 2026US 2026/0275563 A1ACM Research (Shanghai) Inc.
Most cited
By later US patents
- Precursor source mixtures666US 6,984,591 B1International Business Machines Corporation · 2006
- Selective electroless copper deposited interconnect plugs for ULSI applications638US 5,674,787 ASematech, Inc. · 1997
- Use of cobalt tungsten phosphide as a barrier material for copper metallization608US 5,695,810 ACornell Research Foundation, Inc. · 1997
- Method and structure to improve reliability of copper interconnects562US 7,129,165 B2ASM Nutool, Inc. · 2006
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004