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US 2026/0305207 A1Published application
Method for controlled spalling of high fracture toughness materials
OwnerConnor P. Horn, Supratik Guhainventors
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Abstract
The disclosure is directed to methods for spalling a substrate, products made by performing the methods, and apparatus and medium capable of performing the methods. One method includes obtaining a substrate; depositing a seed layer on the substrate; generating an edge around the seed layer for crack initiation in the substrate; and electroplating a stressor layer on the seed layer in an electroplating bath to spall the substrate to obtain a spalled substrate and a spalled film.
Claims20
A method for spalling a substrate, the method comprising:
- obtaining a substrate;
- depositing a seed layer on the substrate;
- generating an edge around the seed layer for crack initiation in the substrate;
- and
- electroplating a stressor layer on the seed layer in an electroplating bath to spall the substrate to obtain a spalled substrate and a spalled film.
2 more elements
An apparatus comprising a film, wherein:
- the film is made by a method for spalling a substrate, the method comprising:
- obtaining the substrate;
- depositing a seed layer on the substrate;
- generating an edge around the seed layer for crack initiation in the substrate;
- and
- electroplating a stressor layer on the seed layer in an electroplating bath to spall the substrate to obtain the film.
3 more elements
A device comprising:
- a film, wherein the film is made by a method for spalling a substrate, the method comprising:
- obtaining the substrate;
- depositing a seed layer on the substrate;
- generating an edge around the seed layer for crack initiation in the substrate;
- and
- electroplating a stressor layer on the seed layer in an electroplating bath to spall the substrate to obtain the film;
- and
- a second substrate, wherein the film is bonded onto the second substrate.
5 more elements
Dependencies are inferred from the claim text.