Film forming method, semiconductor device, manufacturing method thereof and substrate processing apparatus therefor
AssigneeTokyo Electron Limited
InventorsHidenori Miyoshi, Shuji Azumo
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AssigneeTokyo Electron Limited
InventorsHidenori Miyoshi, Shuji Azumo
Estimating the term…
In a method for forming a stacked substrate of a MOS (Metal Oxide Semiconductor) structure including an oxide film serving as a gate insulating film formed on a semiconductor material layer having a film or substrate shape; and a conductive film serving as a gate electrode formed on the oxide film, a polysilane film on the semiconductor material layer is formed by coating a polysilane solution on a surface of a substrate to which the semiconductor material layer is exposed. A film containing metal ions is formed on the polysilane film by coating a metal salt solution thereon, and the polysilane film and the film containing metal ions are respectively modified into a polysiloxane film and a film containing fine metal particles to form the stacked substrate.
A method for forming a stacked substrate of a MOS (Metal Oxide Semiconductor) structure including an oxide film serving as a gate insulating film formed on a semiconductor material layer having a film or substrate shape;
A method for forming a stacked substrate of a MOS structure including a gate insulating film having a first and a second insulating film formed on a semiconductor material layer having a film or substrate shape;
A method for manufacturing a semiconductor device of a MOS structure including an oxide film serving as a gate insulating film formed on a semiconductor material layer having a film or substrate shape;
Dependencies are inferred from the claim text.