H10P 14/48
Electroless plating
Official title: {Electroless plating}
H10P14/48 (Electroless plating) appears on 1 US grants and 4 published applications in this corpus.
Search patents in H10P- Granted patents
- 1
- Published applications
- 4
- Assignees
- 5
- Inventors
- 9
- Latest grant
- 12 Nov 2002
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 0 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Substrate liquid processing method and substrate liquid processing apparatus27 Aug 2026US 2026/0255892 A1Tokyo Electron Limited
- Surface treatment method for silicon body and method of manufacturing silicon structural body6 Aug 2026US 2026/0231700 A1Nagano Prefecture
- Method for processing insulation layer, method for producing redistribution layer, and processing apparatus11 Jun 2026US 2026/0165150 A1Panasonic Intellectual Property Management Co., Ltd.
- Process for fabricating a semiconductor device6 Sep 2001US 2001/0019892 A1Sony Corporation
Most cited
By later US patents