H05K 2201/2081
Compound repelling a metal
Official title: Compound repelling a metal, e.g. solder
H05K2201/2081 (Compound repelling a metal) appears on 184 US grants and 153 published applications in this corpus.
Search patents in H05K- Granted patents
- 184
- Published applications
- 153
- Assignees
- 120
- Inventors
- 497
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 7 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 8 | 0 |
| 1995 | 3 | 0 |
| 1996 | 9 | 0 |
| 1997 | 6 | 0 |
| 1998 | 6 | 0 |
| 1999 | 4 | 0 |
| 2000 | 5 | 0 |
| 2001 | 7 | 1 |
| 2002 | 6 | 7 |
| 2003 | 4 | 8 |
| 2004 | 2 | 5 |
| 2005 | 6 | 14 |
| 2006 | 4 | 7 |
| 2007 | 7 | 4 |
| 2008 | 4 | 10 |
| 2009 | 3 | 9 |
| 2010 | 9 | 10 |
| 2011 | 4 | 3 |
| 2012 | 6 | 4 |
| 2013 | 6 | 2 |
| 2014 | 4 | 0 |
| 2015 | 4 | 5 |
| 2016 | 6 | 4 |
| 2017 | 4 | 4 |
| 2018 | 1 | 2 |
| 2019 | 2 | 1 |
| 2020 | 0 | 0 |
| 2021 | 2 | 3 |
| 2022 | 0 | 2 |
| 2023 | 2 | 10 |
| 2024 | 3 | 11 |
| 2025 | 10 | 16 |
| 2026 | 6 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- PCB fabrication with EMI film on multi-layer rigid PCB8 Sep 2026US 12,733,089 B2Intel Corporation
- Circuit board and manufacturing method thereof1 Sep 2026US 12,727,078 B2Samsung Electro-Mechanics Co., Ltd.
- Flexible circuit board and method for manufacturing same4 Aug 2026US 12,701,652 B2Avary Holding (Shenzhen) Co., Limited.
- Printed circuit board, manufacturing method thereof, and battery pack including the same4 Aug 2026US 12,701,656 B2LG Energy Solution, Ltd.
- Semiconductor package28 Jul 2026US 12,696,775 B2Samsung Electronics Co., Ltd.
- Component Carrier and a Method of Manufacturing a Component Carrier1 Oct 2026US 2026/0304611 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Printed circuit board24 Sep 2026US 2026/0292985 A1Samsung Electro-Mechanics Co., Ltd.
- Connection carrier, method for producing a solder joint and device24 Sep 2026US 2026/0292998 A1ams-OSRAM International GmbH
- Printed wiring board and method for manufacturing the same3 Sep 2026US 2026/0262163 A1Ibiden Co., Ltd.
- Printed circuit board13 Aug 2026US 2026/0239529 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Semiconductor device having leads for mounting to a surface of a printed circuit board244US 5,067,007 AHitachi, Ltd. · 1991
- Wire interconnect structures for connecting an integrated circuit to a substrate216US 5,334,804 AFujitsu Limited · 1994
- Components with conductive solder mask layers133US 6,329,605 B1Tessera, Inc. · 2001
- Method of making electronic module with multiple solder dams in soldermask window125US 5,798,285 AInternational Business Machines Corporation · 1998
- Method of building solder bumps114US 4,950,623 AMicroelectronics Center of North Carolina · 1990