PCB fabrication with EMI film on multi-layer rigid PCB
AssigneeIntel Corporation
InventorsArumanayagam Rajasekar, Hariharan Kaliyavarathan, Srinivas Reddy B.M., Yagnesh Vinodrai Waghela, Piyush Bhatt
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Abstract
Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a core and routing layers over and under the core. In an embodiment, a multi-layer shield is over at least one of the routing layers. In an embodiment, the multi-layer shield comprises a metallic layer with a first surface and a second surface opposite from the first surface, and a conductive adhesive over the first surface of the metallic layer. In an embodiment, a base layer is over the second surface of the metallic layer, where the base layer is electrically insulating.
Claims20
A printed circuit board (PCB), comprising:
- a core;
- routing layers over and under the core;
- and
- a multi-layer shield over at least one of the routing layers, wherein the multi-layer shield comprises:
- a metallic layer with a first surface and a second surface opposite from the first surface;
- a conductive adhesive over the first surface of the metallic layer;
- and
- a base layer over the second surface of the metallic layer, wherein the base layer is electrically insulating.
A printed circuit board (PCB), comprising:
- a routing layer;
- a solder resist over the routing layer, wherein an opening in the solder resist exposes a metallic feature in the routing layer;
- and
- a multi-layer shield over the solder resist, wherein the multi-layer shield comprises:
- a conductive adhesive;
- a metallic layer on the conductive adhesive, wherein the conductive adhesive electrically couples the metallic layer to the metallic feature;
- and
- a base layer on the metallic layer, wherein the base layer is an electrically insulating material.
A computing system, comprising:
- a board, wherein the board comprises:
- an electromagnetic interference (EMI) shield that includes a metallic layer and an electrically conductive adhesive that electrically couples the metallic layer to an electrical ground of the board;
- a package substrate coupled to the board;
- and
- a die coupled to the package substrate.
Dependencies are inferred from the claim text.