H05K 2201/09536
Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
H05K2201/09536 (Buried plated through-holes, i.e. plated through-holes formed in a core before lamination) appears on 720 US grants and 650 published applications in this corpus.
Search patents in H05K- Granted patents
- 720
- Published applications
- 650
- Assignees
- 223
- Inventors
- 1,331
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 6 | 0 |
| 1989 | 7 | 0 |
| 1990 | 2 | 0 |
| 1991 | 5 | 0 |
| 1992 | 5 | 0 |
| 1993 | 8 | 0 |
| 1994 | 9 | 0 |
| 1995 | 17 | 0 |
| 1996 | 19 | 0 |
| 1997 | 10 | 0 |
| 1998 | 18 | 0 |
| 1999 | 10 | 0 |
| 2000 | 11 | 0 |
| 2001 | 33 | 20 |
| 2002 | 41 | 36 |
| 2003 | 24 | 30 |
| 2004 | 41 | 54 |
| 2005 | 24 | 42 |
| 2006 | 33 | 47 |
| 2007 | 32 | 57 |
| 2008 | 40 | 70 |
| 2009 | 28 | 52 |
| 2010 | 46 | 39 |
| 2011 | 37 | 29 |
| 2012 | 39 | 21 |
| 2013 | 20 | 11 |
| 2014 | 31 | 14 |
| 2015 | 15 | 16 |
| 2016 | 10 | 15 |
| 2017 | 15 | 8 |
| 2018 | 10 | 13 |
| 2019 | 13 | 6 |
| 2020 | 10 | 8 |
| 2021 | 5 | 10 |
| 2022 | 6 | 6 |
| 2023 | 9 | 8 |
| 2024 | 3 | 11 |
| 2025 | 6 | 13 |
| 2026 | 4 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Buried skip vias for improved signal and power integrity6 Oct 2026US 12,757,327 B2NVIDIA Corporation
- Wiring substrate28 Jul 2026US 12,696,392 B2Ibiden Co., Ltd.
- Wiring substrate28 Jul 2026US 12,696,394 B2Toppan Holdings Inc.
- Clustered microvia structure for a high-density interface PCB24 Mar 2026US 12,588,146 B2NVIDIA Corporation
- Three-dimensional (3D) copper in printed circuit boards29 Jul 2025US 12,376,231 B2Apple Inc.
- Multi-layer board17 Sep 2026US 2026/0282226 A1Tong Hsing Electronic Industries, Ltd.
- Hybrid circuit board10 Sep 2026US 2026/0271185 A1Tong Hsing Electronic Industries, Ltd.
- Pcb signal via structure and determination method, determination apparatus, and determination device for pcb signal via structure3 Sep 2026US 2026/0262164 A1Suzhou Metabrain Intelligent Technology Co., Ltd.
- Printed circuit board (pcb) miniaturization by an embedded via-in-via design30 Jul 2026US 2026/0223279 A1Google Inc.
- Hybrid circuit board23 Jul 2026US 2026/0214793 A1Tong Hsing Electronic Industries, Ltd.
Most cited
By later US patents
- Three-dimensional multichip module systems334US 5,111,278 A1992
- High density circuit board and method of making same275US 5,191,174 AInternational Business Machines Corporation · 1993
- Parallel process interposer (PPI)263US 5,404,044 AInternational Business Machines Corporation · 1995
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
- Method for producing multilayer printed wiring boards247US 5,258,094 ANEC Corporation · 1993