Clustered microvia structure for a high-density interface PCB
AssigneeNVIDIA Corporation
InventorsMingyi Yu, Gregory Patrick Bodi, Ananta H. Attaluri, Duy Nguyen
Life of this patent
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Abstract
According to various embodiments, a printed circuit board includes: a buried via formed through one or more layers of the printed circuit board; a first conductive pad that is formed on a first end of the buried via; a first conductive via that is formed through a first layer of the printed circuit board and is connected to the first conductive pad; and a second conductive via that is formed through the first layer of the printed circuit board and is connected to the first conductive pad.
Claims17
A printed circuit board, comprising:
- a buried via formed through a core layer of the printed circuit board and having a first diameter, wherein the buried via routes a power signal;
- a first conductive pad that is formed on a first end of the buried via;
- a first conductive microvia having a cross-section filled with an electrically conductive material that:
- is formed through a first buildup layer of the printed circuit board, that
- is connected to the first conductive pad, and
- has a second diameter less than or equal to than the first diameter, wherein the first conductive microvia routes a first portion of the power signal;
- and
- a second conductive microvia that:
- is formed through the first buildup layer of the printed circuit board
- is connected to the first conductive pad, and
- has the second diameter, wherein the second conductive microvia routes a second portion of the power signal.
A printed circuit board, comprising:
- a first conductive pad formed on a first surface of the printed circuit board;
- a second conductive pad formed on a second surface of the printed circuit board;
- a conductive via structure that routes a power signal and includes multiple microvias, including:
- a first set of microvias that are connected to the first conductive pad, and
- a second set of microvias that are connected to the second conductive pad;
- wherein at least one microvia included in the multiple microvias has a cross-section filled with an electrically conductive material and routes a portion of the power signal, and
- wherein the conductive via structure is formed through multiple layers of the printed circuit board;
- and
- a through-hole via that is disposed between the first set of microvias and the second set of microvias.
A processing subsystem, comprising:
- a printed circuit board (PCB) that includes:
- a buried via formed through a core layer of the PCB and having a first diameter, wherein the buried via routes a power signal;
- a first conductive pad that is formed on a first end of the buried via;
- a first conductive microvia having a cross-section filled with an electrically conductive material that:
- is formed through a first layer of the PCB,
- is connected to the first conductive pad,
- has a second diameter less than or equal to the first diameter, wherein the first conductive microvia routes a first portion of the power signal;
- and
- a second conductive microvia that:
- is formed through the first layer of the PCB,
- is connected to the first conductive pad, and
- has the second diameter, wherein the second conductive microvia routes a second portion of the power signal;
- and
- a processor mounted on a first side of the PCB that receives both the first portion and the second portion of the power signal.
Dependencies are inferred from the claim text.