H01J 37/3244
Gas supply means
Official title: {Gas supply means}
H01J37/3244 (Gas supply means) appears on 4,659 US grants and 6,922 published applications in this corpus.
Search patents in H01J- Granted patents
- 4,659
- Published applications
- 6,922
- Assignees
- 940
- Inventors
- 10,351
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 5 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 4 | 0 |
| 1983 | 4 | 0 |
| 1984 | 9 | 0 |
| 1985 | 10 | 0 |
| 1986 | 11 | 0 |
| 1987 | 5 | 0 |
| 1988 | 5 | 0 |
| 1989 | 7 | 0 |
| 1990 | 13 | 0 |
| 1991 | 10 | 0 |
| 1992 | 16 | 0 |
| 1993 | 18 | 0 |
| 1994 | 21 | 0 |
| 1995 | 24 | 0 |
| 1996 | 20 | 0 |
| 1997 | 37 | 0 |
| 1998 | 31 | 0 |
| 1999 | 41 | 0 |
| 2000 | 58 | 0 |
| 2001 | 58 | 30 |
| 2002 | 64 | 75 |
| 2003 | 55 | 70 |
| 2004 | 40 | 91 |
| 2005 | 29 | 116 |
| 2006 | 32 | 114 |
| 2007 | 38 | 109 |
| 2008 | 32 | 120 |
| 2009 | 44 | 165 |
| 2010 | 77 | 133 |
| 2011 | 75 | 159 |
| 2012 | 90 | 147 |
| 2013 | 98 | 144 |
| 2014 | 112 | 202 |
| 2015 | 153 | 316 |
| 2016 | 214 | 362 |
| 2017 | 216 | 392 |
| 2018 | 232 | 358 |
| 2019 | 320 | 427 |
| 2020 | 342 | 408 |
| 2021 | 283 | 461 |
| 2022 | 331 | 559 |
| 2023 | 291 | 573 |
| 2024 | 361 | 483 |
| 2025 | 397 | 502 |
| 2026 | 319 | 406 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Film forming method and film forming apparatus6 Oct 2026US 12,753,485 B2Tokyo Electron Limited
- Flow control arrangements, semiconductor processing systems having flow control arrangements, and flow control methods6 Oct 2026US 12,753,499 B2ASM IP Holding B. V.
- Substrate processing device and method for cleaning substrate processing device6 Oct 2026US 12,753,506 B2Jusung Engineering Co., Ltd.
- Plasma processing apparatus6 Oct 2026US 12,755,939 B2Tokyo Electron Limited
- Apparatus for conducting plasma surface treatment, board treatment system having the same, and method of manufacturing semiconductor devices using the same6 Oct 2026US 12,755,942 B2New Power Plasma Co., Ltd.
- Etching method and plasma processing apparatus8 Oct 2026US 2026/0311969 A1Tokyo Electron Limited
- Showerhead structure, and substrate processing chamber and semiconductor processing apparatus having the same8 Oct 2026US 2026/0311970 A1ASM IP Holding B. V.
- Device for reducing a parasitic plasma and a substrate processing apparatus having the same8 Oct 2026US 2026/0311971 A1ASM IP Holding B. V.
- Integration of vapor deposition process into plasma etch reactor8 Oct 2026US 2026/0311972 A1Lam Research Corporation
- Method of forming protective film on outer circumferential portion including bevel portion of substrate8 Oct 2026US 2026/0311973 A1Ebara Corporation
Most cited
By later US patents
- Apparatus and method for growth of a thin film940US 6,511,539 B1ASM America, Inc. · 2003
- Integration of remote plasma generator with semiconductor processing chamber865US 6,387,207 B1APPLIED Materials.Inc. · 2002
- Thermally floating pedestal collar in a chemical vapor deposition chamber805US 5,846,332 AAPPLIED Materials.Inc. · 1998
- Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process777US 5,000,113 AAPPLIED Materials.Inc. · 1991
- Plasma uniformity control by gas diffuser hole design746US 8,083,853 B2APPLIED Materials.Inc. · 2011