H01J 37/32385
Treating the edge of the workpieces
Official title: {Treating the edge of the workpieces}
H01J37/32385 (Treating the edge of the workpieces) appears on 49 US grants and 73 published applications in this corpus.
Search patents in H01J- Granted patents
- 49
- Published applications
- 73
- Assignees
- 19
- Inventors
- 137
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 2 |
| 2012 | 3 | 2 |
| 2013 | 1 | 1 |
| 2014 | 1 | 3 |
| 2015 | 1 | 5 |
| 2016 | 2 | 4 |
| 2017 | 4 | 2 |
| 2018 | 1 | 7 |
| 2019 | 2 | 3 |
| 2020 | 6 | 8 |
| 2021 | 7 | 8 |
| 2022 | 2 | 6 |
| 2023 | 8 | 4 |
| 2024 | 3 | 9 |
| 2025 | 5 | 6 |
| 2026 | 3 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Apparatus for treating substrate and method for aligning dielectric plate using the same5 May 2026US 12,620,560 B2Psk Inc.
- Substrate processing apparatus27 Jan 2026US 12,537,170 B2Tokyo Electron Limited
- Arcing reduction in wafer bevel edge plasma processing13 Jan 2026US 12,525,434 B2Lam Research Corporation
- Apparatus for edge control during plasma processing16 Dec 2025US 12,500,067 B2Tokyo Electron Limited
- Substrate processing apparatus and substrate processing method23 Sep 2025US 12,424,417 B2Psk Inc.
- Plasma Processing Apparatus and Plasma Processing Method7 May 2026US 2026/0128259 A1Tokyo Electron Limited
- Apparatus for edge control during plasma processing12 Mar 2026US 2026/0074152 A1Tokyo Electron Limited
- Substrate edge profile treatment28 Aug 2025US 2025/0273436 A1APPLIED Materials.Inc.
- Grinding apparatus21 Aug 2025US 2025/0262707 A1Tokyo Seimitsu Co., Ltd.
- Ion generator and ion implanter29 May 2025US 2025/0174424 A1Sumitomo Heavy Industries Ion Technology Co., Ltd.
Most cited
By later US patents
- Method for reducing particle generation at bevel portion of substrate468US 9,343,343 B2ASM IP Holding B. V. · 2016
- Edge removal of films using externally generated plasma species31US 8,100,081 B1Novellus Systems, Inc. · 2012
- Control of water bow in multiple stations14US 10,553,465 B2Lam Research Corporation · 2020
- Systems and methods for achieving a pre-determined factor associated with an edge region within a plasma chamber by synchronizing main and edge RF generators12US 10,283,330 B2Lam Research Corporation · 2019
- Edge ring assembly for a substrate support in a plasma processing chamber12US 10,847,347 B2APPLIED Materials.Inc. · 2020