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US 9,343,343 B2Granted
Method for reducing particle generation at bevel portion of substrate
AssigneeASM IP Holding B.V.
InventorYukihiro Mori
Life of this patent
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Abstract
A method for transporting a substrate using an end effector which mechanically clamps a periphery of the substrate includes: before transporting the substrate, depositing a compressive film only on, at, or in a bevel portion of the substrate; and transporting the substrate whose bevel portion is covered by the compressive film as the outermost film, using an end effector while mechanically clamping the periphery of the substrate.
Claims3
An apparatus for plasma-enhanced CVD, comprising:
- upper and lower conductive electrodes, between which a substrate is loaded, said upper and lower conductive electrodes being arranged so that a plasma is generated only over or at a bevel portion of the substrate, wherein the upper and lower conductive electrodes radially extend in parallel to the substrate beyond the entire periphery of the substrate, and a gas nozzle or nozzles are arranged at or near a center of the upper conductive electrode.
Dependencies are inferred from the claim text.