Substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsJun Yamawaku, Chishio Koshimizu
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Abstract
There is provided a focus ring that is capable of preventing deposits from adhering to a member having a lower temperature in a gap between two members having different temperatures. A focus ring 25 is disposed to surround a peripheral portion of a wafer W in a chamber 11 of a substrate processing apparatus 10. The focus ring 25 includes an inner focus ring 25a and an outer focus ring 25b. Here, the inner focus ring 25a is placed adjacent to the wafer W and configured to be cooled; and the outer focus ring 25b is placed so as to surround the inner focus ring 25a and configured not to be cooled. Further, a block member 25c is provided in a gap between the inner focus ring 25a and the outer focus ring 25b.
Claims18
A substrate processing apparatus comprising:
- a chamber;
- a substrate support disposed in the chamber;
- a side protection member surrounding the substrate support;
- an inner ring having an inwardly protruded portion and an outwardly protruded portion, the inner ring being disposed so as to surround a substrate on the substrate support;
- an outer ring disposed on a top surface of the side protection member and having an inwardly protruded portion, the inwardly protruded portion of the outer ring vertically overlapping with the outwardly protruded portion of the inner ring, the outer ring being disposed so as to surround the inner ring;
- and
- a lifter configured to lift up the inner ring away from the outer ring.
Dependencies are inferred from the claim text.