H01J 2237/3321
Cvd [chemical vapor deposition]
Official title: CVD [Chemical Vapor Deposition]
H01J2237/3321 (Cvd [chemical vapor deposition]) appears on 807 US grants and 1,202 published applications in this corpus.
Search patents in H01J- Granted patents
- 807
- Published applications
- 1,202
- Assignees
- 281
- Inventors
- 2,466
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 5 | 0 |
| 1990 | 6 | 0 |
| 1991 | 6 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 6 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 5 | 0 |
| 2002 | 3 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 5 |
| 2006 | 0 | 6 |
| 2007 | 1 | 4 |
| 2008 | 0 | 6 |
| 2009 | 2 | 8 |
| 2010 | 1 | 5 |
| 2011 | 4 | 6 |
| 2012 | 3 | 5 |
| 2013 | 3 | 10 |
| 2014 | 7 | 18 |
| 2015 | 11 | 32 |
| 2016 | 21 | 50 |
| 2017 | 31 | 90 |
| 2018 | 43 | 98 |
| 2019 | 67 | 96 |
| 2020 | 78 | 130 |
| 2021 | 71 | 104 |
| 2022 | 86 | 120 |
| 2023 | 66 | 114 |
| 2024 | 82 | 104 |
| 2025 | 84 | 117 |
| 2026 | 80 | 73 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Film forming method and film forming apparatus6 Oct 2026US 12,753,485 B2Tokyo Electron Limited
- Arc current reduction from an electrostatic chuck6 Oct 2026US 12,757,680 B2APPLIED Materials.Inc.
- Remote plasma deposition with electrostatic clamping6 Oct 2026US 12,757,682 B2Lam Research Corporation
- Plasma showerhead assembly and method of reducing defects29 Sep 2026US 12,747,502 B2APPLIED Materials.Inc.
- Splitter circuit for wafer processing system29 Sep 2026US 12,749,655 B2APPLIED Materials.Inc.
- Plasma processing apparatus, power source system, and plasma processing method8 Oct 2026US 2026/0311967 A1Tokyo Electron Limited
- Method of forming protective film on outer circumferential portion including bevel portion of substrate8 Oct 2026US 2026/0311973 A1Ebara Corporation
- Monolithic modular high-frequency plasma source1 Oct 2026US 2026/0302134 A1APPLIED Materials.Inc.
- Plasma and Photon assisted Metal-Organic Chemical Vapor Deposition24 Sep 2026US 2026/0286510 A1PhantaField Inc.
- Real-time detection of particulate matter during deposition chamber manufacturing24 Sep 2026US 2026/0290768 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Plasma uniformity control by gas diffuser hole design746US 8,083,853 B2APPLIED Materials.Inc. · 2011
- Processing apparatus and method for plasma processing739US 5,134,965 AHitachi, Ltd. · 1992
- Plasma enhanced chemical processing reactor and method593US 5,792,272 AWatkins-Johnson Company · 1998
- Pulsed dual radio frequency CVD process568US 4,837,185 AIntel Corporation · 1989
- Process gas management for an inductively-coupled plasma deposition reactor535US 9,021,985 B2ASM IP Holdings B.V. · 2015