H01J 2237/332
Coating
H01J2237/332 (Coating) appears on 1,912 US grants and 2,874 published applications in this corpus.
Search patents in H01J- Granted patents
- 1,912
- Published applications
- 2,874
- Assignees
- 578
- Inventors
- 5,225
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 7 | 0 |
| 1990 | 7 | 0 |
| 1991 | 10 | 0 |
| 1992 | 14 | 0 |
| 1993 | 13 | 0 |
| 1994 | 16 | 0 |
| 1995 | 10 | 0 |
| 1996 | 17 | 0 |
| 1997 | 12 | 0 |
| 1998 | 14 | 0 |
| 1999 | 10 | 0 |
| 2000 | 11 | 0 |
| 2001 | 15 | 2 |
| 2002 | 11 | 4 |
| 2003 | 8 | 11 |
| 2004 | 6 | 7 |
| 2005 | 4 | 19 |
| 2006 | 6 | 13 |
| 2007 | 3 | 8 |
| 2008 | 2 | 16 |
| 2009 | 6 | 16 |
| 2010 | 2 | 19 |
| 2011 | 11 | 19 |
| 2012 | 8 | 18 |
| 2013 | 7 | 36 |
| 2014 | 20 | 40 |
| 2015 | 39 | 131 |
| 2016 | 64 | 133 |
| 2017 | 71 | 150 |
| 2018 | 94 | 158 |
| 2019 | 129 | 176 |
| 2020 | 134 | 233 |
| 2021 | 141 | 250 |
| 2022 | 170 | 315 |
| 2023 | 157 | 314 |
| 2024 | 223 | 274 |
| 2025 | 234 | 297 |
| 2026 | 193 | 215 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Coated cutting tool with an alternating layer composition6 Oct 2026US 12,752,344 B2Walter AG
- Semiconductor manufacturing apparatus member and semiconductor manufacturing apparatus6 Oct 2026US 12,753,480 B2Toto Ltd.
- Film forming method and film forming apparatus6 Oct 2026US 12,753,485 B2Tokyo Electron Limited
- Shutter disc for a semiconductor processing tool6 Oct 2026US 12,753,488 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Methods for reducing photoresist and carbon etch rates in an ICP process chamber using a silicon-based chamber pre-coat6 Oct 2026US 12,757,659 B2APPLIED Materials.Inc.
- Plasma processing apparatus, power source system, and plasma processing method8 Oct 2026US 2026/0311967 A1Tokyo Electron Limited
- Showerhead structure, and substrate processing chamber and semiconductor processing apparatus having the same8 Oct 2026US 2026/0311970 A1ASM IP Holding B. V.
- Method of forming protective film on outer circumferential portion including bevel portion of substrate8 Oct 2026US 2026/0311973 A1Ebara Corporation
- Detecting and locating anomalous plasma events in multi-station processing chambers8 Oct 2026US 2026/0311976 A1Lam Research Corporation
- Sputtering System with a Plasma Monitoring Device and an Ion Source8 Oct 2026US 2026/0311978 A1Dah Young Vacuum Equipment Co., Ltd.
Most cited
By later US patents
- Plasma uniformity control by gas diffuser hole design746US 8,083,853 B2APPLIED Materials.Inc. · 2011
- Processing apparatus and method for plasma processing739US 5,134,965 AHitachi, Ltd. · 1992
- Plasma enhanced chemical processing reactor and method593US 5,792,272 AWatkins-Johnson Company · 1998
- Surface-treated shower head for use in a substrate processing chamber584US 6,182,603 B2Applied Komatsu Technology, Inc. · 2001
- Plasma treatment method and apparatus581US 5,242,539 AHitachi, Ltd. · 1993