H01J 2237/3322
Problems associated with coating
H01J2237/3322 (Problems associated with coating) appears on 359 US grants and 407 published applications in this corpus.
Search patents in H01J- Granted patents
- 359
- Published applications
- 407
- Assignees
- 159
- Inventors
- 1,083
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 9 | 0 |
| 1995 | 5 | 0 |
| 1996 | 6 | 0 |
| 1997 | 6 | 0 |
| 1998 | 8 | 0 |
| 1999 | 7 | 0 |
| 2000 | 7 | 0 |
| 2001 | 11 | 2 |
| 2002 | 8 | 3 |
| 2003 | 7 | 9 |
| 2004 | 5 | 6 |
| 2005 | 4 | 14 |
| 2006 | 5 | 6 |
| 2007 | 2 | 2 |
| 2008 | 1 | 6 |
| 2009 | 4 | 5 |
| 2010 | 1 | 9 |
| 2011 | 5 | 8 |
| 2012 | 3 | 6 |
| 2013 | 1 | 6 |
| 2014 | 9 | 17 |
| 2015 | 12 | 31 |
| 2016 | 14 | 38 |
| 2017 | 17 | 19 |
| 2018 | 18 | 26 |
| 2019 | 27 | 30 |
| 2020 | 23 | 24 |
| 2021 | 24 | 26 |
| 2022 | 18 | 17 |
| 2023 | 18 | 27 |
| 2024 | 19 | 19 |
| 2025 | 14 | 23 |
| 2026 | 21 | 28 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Remote plasma deposition with electrostatic clamping6 Oct 2026US 12,757,682 B2Lam Research Corporation
- Plasma showerhead assembly and method of reducing defects29 Sep 2026US 12,747,502 B2APPLIED Materials.Inc.
- Chucking status detection with chucking sensor normalized figure of merit and active chucking voltage control8 Sep 2026US 12,731,767 B2APPLIED Materials.Inc.
- RF blocker for uniformity control18 Aug 2026US 12,712,160 B2APPLIED Materials.Inc.
- Apparatus for clamping a substrate on a mono-polar electrostatic chuck for deposition of photoresist films21 Jul 2026US 12,690,418 B2APPLIED Materials.Inc.
- Plasma and Photon assisted Metal-Organic Chemical Vapor Deposition24 Sep 2026US 2026/0286510 A1PhantaField Inc.
- Wafer edge profile control using connected edge ring hardware24 Sep 2026US 2026/0290771 A1APPLIED Materials.Inc.
- Rf blocker for uniformity control17 Sep 2026US 2026/0279740 A1APPLIED Materials.Inc.
- Ultra High Purity Conditions for Atomic Scale Processing27 Aug 2026US 2026/0253839 A1Kurt J. Lesker Company
- Method for prediction of ion energy distribution in plasma process20 Aug 2026US 2026/0245843 A1Tokyo Electron Limited
Most cited
By later US patents
- Plasma uniformity control by gas diffuser hole design746US 8,083,853 B2APPLIED Materials.Inc. · 2011
- Plasma enhanced chemical processing reactor and method593US 5,792,272 AWatkins-Johnson Company · 1998
- Surface-treated shower head for use in a substrate processing chamber584US 6,182,603 B2Applied Komatsu Technology, Inc. · 2001
- Plasma treatment method and apparatus581US 5,242,539 AHitachi, Ltd. · 1993
- Pulsed dual radio frequency CVD process568US 4,837,185 AIntel Corporation · 1989