H01J 2237/3327
Coating high aspect ratio workpieces
H01J2237/3327 (Coating high aspect ratio workpieces) appears on 79 US grants and 44 published applications in this corpus.
Search patents in H01J- Granted patents
- 79
- Published applications
- 44
- Assignees
- 27
- Inventors
- 196
- Latest grant
- 30 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 1 |
| 2002 | 5 | 1 |
| 2003 | 4 | 5 |
| 2004 | 4 | 5 |
| 2005 | 4 | 7 |
| 2006 | 4 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 2 |
| 2009 | 2 | 2 |
| 2010 | 1 | 0 |
| 2011 | 1 | 2 |
| 2012 | 1 | 1 |
| 2013 | 0 | 0 |
| 2014 | 3 | 1 |
| 2015 | 1 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 1 | 2 |
| 2019 | 1 | 2 |
| 2020 | 1 | 3 |
| 2021 | 2 | 3 |
| 2022 | 1 | 1 |
| 2023 | 2 | 1 |
| 2024 | 0 | 1 |
| 2025 | 2 | 1 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Adjustable de-chucking voltage30 Sep 2025US 12,431,339 B2APPLIED Materials.Inc.
- High aspect ratio etch with infinite selectivity8 Jul 2025US 12,354,880 B2Lam Research Corporation
- Thin film forming method21 Nov 2023US 11,823,866 B2ASM IP Holding B. V.
- Methods for depositing dielectric material18 Apr 2023US 11,631,591 B2APPLIED Materials.Inc.
- Processing of workpieces using deposition process and etch process4 Oct 2022US 11,462,413 B2Beijing E-Town Semiconductor Technology Co., Ltd.
- Substrate processing apparatus23 Apr 2026US 2026/0112577 A1Kokusai Electric Corporation
- Atomic layer deposition apparatus5 Mar 2026US 2026/0062808 A1Samsung Electronics Co., Ltd.
- Carbon mask deposition13 Feb 2025US 2025/0054760 A1Lam Research Corporation
- Adjustable de-chucking voltage31 Oct 2024US 2024/0363315 A1APPLIED Materials.Inc.
- High aspect ratio etch with infinite selectivity16 Mar 2023US 2023/0081817 A1Lam Research Corporation
Most cited
By later US patents
- Gap fill for high aspect ratio structures367US 6,596,654 B1Novellus Systems, Inc. · 2003
- Gas chemistry cycling to achieve high aspect ratio gapfill with HDP-CVD320US 6,335,288 B12002
- High-density plasma process for filling high aspect ratio structures272US 6,846,745 B1Novellus Systems, Inc. · 2005
- Method and apparatus for plasma treatment of a surface271US 5,645,645 ABoard of Trustees operating Michigan State University · 1997
- Apparatus and method for magnetron-enhanced plasma-assisted chemical vapor deposition176US 4,668,365 AAPPLIED Materials.Inc. · 1987