Adjustable de-chucking voltage

A process chamber, comprising:

• a lid assembly;
• a substrate support disposed within a process volume, wherein the substrate support comprises a chucking electrode and a lift pin assembly, wherein the lift pin assembly is movable relative to the chucking electrode via an actuator;
• a power source electrically coupled to the chucking electrode;
• a memory;
• and
• a processor coupled to the memory, the processor being configured to:
• monitor a property associated with the lift pin assembly, and
• adjust a first voltage level applied to the chucking electrode via the power source in response to the property associated with the lift pin assembly satisfying one or more criteria.

A process chamber, comprising:

• a lid assembly;
• a chamber body coupled to the lid assembly by a spacer, the spacer and the chamber body defining a process volume;
• a substrate support disposed and movable within the process volume, wherein the substrate support comprises a chucking electrode, a heater element, and a lift pin assembly, wherein the lift pin assembly is movable relative to the chucking electrode via an actuator;
• a power source electrically coupled to the chucking electrode;
• a memory;
• and
• a processor coupled to the memory, the processor being configured to:
• monitor a property associated with the lift pin assembly,
• monitor a first voltage level associated with the heater element, and
• adjust a second voltage level applied to the chucking electrode via the power source based at least in part on the first voltage level in response to the property associated with the lift pin assembly satisfying one or more criteria.