H01J 2237/33
Characterised by the type of processing
Official title: characterised by the type of processing
H01J2237/33 (Characterised by the type of processing) appears on 4,772 US grants and 7,038 published applications in this corpus.
Search patents in H01J- Granted patents
- 4,772
- Published applications
- 7,038
- Assignees
- 1,051
- Inventors
- 10,844
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 6 | 0 |
| 1982 | 4 | 0 |
| 1983 | 2 | 0 |
| 1984 | 8 | 0 |
| 1985 | 6 | 0 |
| 1986 | 11 | 0 |
| 1987 | 7 | 0 |
| 1988 | 9 | 0 |
| 1989 | 16 | 0 |
| 1990 | 15 | 0 |
| 1991 | 11 | 0 |
| 1992 | 21 | 0 |
| 1993 | 33 | 0 |
| 1994 | 37 | 0 |
| 1995 | 36 | 0 |
| 1996 | 33 | 0 |
| 1997 | 26 | 0 |
| 1998 | 26 | 0 |
| 1999 | 33 | 0 |
| 2000 | 40 | 0 |
| 2001 | 41 | 20 |
| 2002 | 41 | 35 |
| 2003 | 37 | 32 |
| 2004 | 26 | 53 |
| 2005 | 21 | 49 |
| 2006 | 20 | 51 |
| 2007 | 17 | 51 |
| 2008 | 18 | 52 |
| 2009 | 22 | 47 |
| 2010 | 27 | 53 |
| 2011 | 31 | 54 |
| 2012 | 31 | 61 |
| 2013 | 34 | 89 |
| 2014 | 64 | 142 |
| 2015 | 120 | 318 |
| 2016 | 186 | 314 |
| 2017 | 201 | 455 |
| 2018 | 253 | 413 |
| 2019 | 345 | 459 |
| 2020 | 373 | 542 |
| 2021 | 331 | 569 |
| 2022 | 408 | 655 |
| 2023 | 328 | 684 |
| 2024 | 447 | 634 |
| 2025 | 532 | 692 |
| 2026 | 432 | 514 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H01J 2237/334EtchingIndexing code3,064
- H01J 2237/332CoatingIndexing code1,912
- H01J 2237/335CleaningIndexing code321
- H01J 2237/336Changing physical properties of treated surfacesIndexing code117
- H01J 2237/338Changing chemical properties of treated surfacesIndexing code108
- H01J 2237/339Synthesising componentsIndexing code12
Recent patents
- Coated cutting tool with an alternating layer composition6 Oct 2026US 12,752,344 B2Walter AG
- Semiconductor manufacturing apparatus member and semiconductor manufacturing apparatus6 Oct 2026US 12,753,480 B2Toto Ltd.
- Film forming method and film forming apparatus6 Oct 2026US 12,753,485 B2Tokyo Electron Limited
- Shutter disc for a semiconductor processing tool6 Oct 2026US 12,753,488 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Pulsed voltage waveform with binary pulses for biasing of plasma6 Oct 2026US 12,755,934 B2APPLIED Materials.Inc.
- Pulse windowing optical sensor8 Oct 2026US 2026/0309547 A1Tokyo Electron Limited
- Plasma processing apparatus, power source system, and plasma processing method8 Oct 2026US 2026/0311967 A1Tokyo Electron Limited
- Etching method and plasma processing apparatus8 Oct 2026US 2026/0311969 A1Tokyo Electron Limited
- Showerhead structure, and substrate processing chamber and semiconductor processing apparatus having the same8 Oct 2026US 2026/0311970 A1ASM IP Holding B. V.
- Integration of vapor deposition process into plasma etch reactor8 Oct 2026US 2026/0311972 A1Lam Research Corporation
Most cited
By later US patents
- Plasma uniformity control by gas diffuser hole design746US 8,083,853 B2APPLIED Materials.Inc. · 2011
- Processing apparatus and method for plasma processing739US 5,134,965 AHitachi, Ltd. · 1992
- Dilute remote plasma clean676US 6,329,297 B1APPLIED Materials.Inc. · 2001
- Plasma monitoring and control method and system625US 5,576,629 AFourth State Technology, Inc. · 1996
- Plasma enhanced chemical processing reactor and method593US 5,792,272 AWatkins-Johnson Company · 1998