H01J 2237/334
Etching
H01J2237/334 (Etching) appears on 3,064 US grants and 4,460 published applications in this corpus.
Search patents in H01J- Granted patents
- 3,064
- Published applications
- 4,460
- Assignees
- 526
- Inventors
- 6,424
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 7 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 8 | 0 |
| 1990 | 6 | 0 |
| 1991 | 1 | 0 |
| 1992 | 5 | 0 |
| 1993 | 19 | 0 |
| 1994 | 21 | 0 |
| 1995 | 25 | 0 |
| 1996 | 16 | 0 |
| 1997 | 11 | 0 |
| 1998 | 13 | 0 |
| 1999 | 18 | 0 |
| 2000 | 22 | 0 |
| 2001 | 17 | 12 |
| 2002 | 22 | 17 |
| 2003 | 21 | 14 |
| 2004 | 15 | 32 |
| 2005 | 8 | 23 |
| 2006 | 14 | 26 |
| 2007 | 8 | 33 |
| 2008 | 16 | 25 |
| 2009 | 10 | 27 |
| 2010 | 17 | 35 |
| 2011 | 16 | 26 |
| 2012 | 17 | 37 |
| 2013 | 22 | 54 |
| 2014 | 44 | 104 |
| 2015 | 82 | 196 |
| 2016 | 137 | 204 |
| 2017 | 143 | 334 |
| 2018 | 177 | 296 |
| 2019 | 240 | 328 |
| 2020 | 284 | 357 |
| 2021 | 226 | 357 |
| 2022 | 280 | 389 |
| 2023 | 184 | 418 |
| 2024 | 265 | 368 |
| 2025 | 336 | 438 |
| 2026 | 267 | 310 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Pulsed voltage waveform with binary pulses for biasing of plasma6 Oct 2026US 12,755,934 B2APPLIED Materials.Inc.
- Process control for ion energy delivery using multiple generators and phase control6 Oct 2026US 12,755,935 B2Lam Research Corporation
- Plasma processing apparatus6 Oct 2026US 12,755,937 B2Tokyo Electron Limited
- Filter circuit and plasma processing apparatus6 Oct 2026US 12,755,938 B2Tokyo Electron Limited
- Plasma processing apparatus and gas exhaust method6 Oct 2026US 12,755,945 B2Hitachi High-Tech Corporation
- Pulse windowing optical sensor8 Oct 2026US 2026/0309547 A1Tokyo Electron Limited
- Etching method and plasma processing apparatus8 Oct 2026US 2026/0311969 A1Tokyo Electron Limited
- Integration of vapor deposition process into plasma etch reactor8 Oct 2026US 2026/0311972 A1Lam Research Corporation
- Detecting and locating anomalous plasma events in multi-station processing chambers8 Oct 2026US 2026/0311976 A1Lam Research Corporation
- Methods and systems for dry etching8 Oct 2026US 2026/0314324 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Plasma monitoring and control method and system625US 5,576,629 AFourth State Technology, Inc. · 1996
- Surface-treated shower head for use in a substrate processing chamber584US 6,182,603 B2Applied Komatsu Technology, Inc. · 2001
- Plasma treatment method and apparatus581US 5,242,539 AHitachi, Ltd. · 1993
- Methods and apparatus for atomic layer etching577US 8,617,411 B2Lam Research Corporation · 2013
- Oxide and metal removal562US 9,309,598 B2APPLIED Materials.Inc. · 2016