H01J 2237/3342
Resist stripping
H01J2237/3342 (Resist stripping) appears on 85 US grants and 106 published applications in this corpus.
Search patents in H01J- Granted patents
- 85
- Published applications
- 106
- Assignees
- 42
- Inventors
- 242
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 2 |
| 2002 | 4 | 4 |
| 2003 | 6 | 8 |
| 2004 | 4 | 10 |
| 2005 | 3 | 8 |
| 2006 | 3 | 10 |
| 2007 | 2 | 7 |
| 2008 | 4 | 3 |
| 2009 | 3 | 6 |
| 2010 | 3 | 2 |
| 2011 | 2 | 1 |
| 2012 | 4 | 2 |
| 2013 | 1 | 2 |
| 2014 | 4 | 5 |
| 2015 | 0 | 0 |
| 2016 | 1 | 1 |
| 2017 | 2 | 3 |
| 2018 | 3 | 3 |
| 2019 | 4 | 3 |
| 2020 | 3 | 6 |
| 2021 | 2 | 3 |
| 2022 | 2 | 7 |
| 2023 | 3 | 2 |
| 2024 | 4 | 5 |
| 2025 | 5 | 2 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Etching method and plasma processing apparatus16 Jun 2026US 12,658,412 B2Tokyo Electron Limited
- Etching method11 Nov 2025US 12,469,711 B2Ulvac, Inc.
- Substrate process apparatus and substrate process method using the same26 Aug 2025US 12,400,836 B2Samsung Electronics Co., Ltd.
- Plasma processing method and plasma processing apparatus8 Jul 2025US 12,354,837 B2Tokyo Electron Limited
- Ring carrier and substrate treating system24 Jun 2025US 12,340,988 B2Semes Co., Ltd.
- Etching method and plasma processing apparatus17 Sep 2026US 2026/0279742 A1Tokyo Electron Limited
- Plasma multi-wafer ashing system24 Jul 2025US 2025/0237959 A1Rockwell Collins, Inc.
- Plasma Strip Tool With Movable Insert3 Jul 2025US 2025/0218740 A1Beijing E-Town Semiconductor Technology Co., Ltd.
- Etching method12 Sep 2024US 2024/0304453 A1Ulvac, Inc.
- Removable mask layer to reduce overhang during re-sputter process in pvd chambers25 Jul 2024US 2024/0249920 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Tin oxide thin film spacers in semiconductor device manufacturing440US 9,824,893 B1Lam Research Corporation · 2017
- Oxygen free plasma stripping process269US 6,281,135 B1Axcelis Technologies, Inc. · 2001
- Showerhead for uniform distribution of process gas108US 5,614,026 ALam Research Corporation · 1997
- Heating plate with planar heating zones for semiconductor processing74US 8,637,794 B2Lam Research Corporation · 2014
- Method of removing resist mask and a method of manufacturing semiconductor device60US 5,628,871 AFujitsu Limited · 1997