H01J 2237/3323
Uniformity
Official title: uniformity
H01J2237/3323 (Uniformity) appears on 171 US grants and 267 published applications in this corpus.
Search patents in H01J- Granted patents
- 171
- Published applications
- 267
- Assignees
- 88
- Inventors
- 662
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 2 |
| 2004 | 0 | 0 |
| 2005 | 0 | 2 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 2 |
| 2009 | 1 | 1 |
| 2010 | 0 | 6 |
| 2011 | 3 | 4 |
| 2012 | 0 | 2 |
| 2013 | 0 | 4 |
| 2014 | 4 | 11 |
| 2015 | 7 | 16 |
| 2016 | 11 | 25 |
| 2017 | 14 | 13 |
| 2018 | 6 | 20 |
| 2019 | 12 | 24 |
| 2020 | 14 | 18 |
| 2021 | 17 | 20 |
| 2022 | 16 | 14 |
| 2023 | 14 | 19 |
| 2024 | 15 | 18 |
| 2025 | 12 | 21 |
| 2026 | 18 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Remote plasma deposition with electrostatic clamping6 Oct 2026US 12,757,682 B2Lam Research Corporation
- Plasma showerhead assembly and method of reducing defects29 Sep 2026US 12,747,502 B2APPLIED Materials.Inc.
- Chucking status detection with chucking sensor normalized figure of merit and active chucking voltage control8 Sep 2026US 12,731,767 B2APPLIED Materials.Inc.
- RF blocker for uniformity control18 Aug 2026US 12,712,160 B2APPLIED Materials.Inc.
- Apparatus for clamping a substrate on a mono-polar electrostatic chuck for deposition of photoresist films21 Jul 2026US 12,690,418 B2APPLIED Materials.Inc.
- Plasma and Photon assisted Metal-Organic Chemical Vapor Deposition24 Sep 2026US 2026/0286510 A1PhantaField Inc.
- Wafer edge profile control using connected edge ring hardware24 Sep 2026US 2026/0290771 A1APPLIED Materials.Inc.
- Rf blocker for uniformity control17 Sep 2026US 2026/0279740 A1APPLIED Materials.Inc.
- Method for prediction of ion energy distribution in plasma process20 Aug 2026US 2026/0245843 A1Tokyo Electron Limited
- Process chamber gas flow improvement13 Aug 2026US 2026/0234797 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Plasma uniformity control by gas diffuser hole design746US 8,083,853 B2APPLIED Materials.Inc. · 2011
- Symmetric plasma process chamber389US 9,741,546 B2APPLIED Materials.Inc. · 2017
- Electron cyclotron resonance plasma source and method of operation102US 5,370,765 AApplied Microwave Plasma Concepts, Inc. · 1994
- Method of operation of electron cyclotron resonance plasma source75US 5,203,960 AApplied Microwave Plasma Concepts, Inc. · 1993
- Electron cyclotron resonance plasma source74US 5,133,826 AApplied Microwave Plasma Concepts, Inc. · 1992