Pulsed dual radio frequency CVD process
AssigneeIntel Corporation
InventorsLeopoldo D. Yau, Galen H. Kawamoto
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Abstract
A method of depositing a thin film of silicon oxynitride (Si.sub.x O.sub.y N.sub.z) onto a semiconductor substrate utilizing dual frequency plasma enhanced chemical vapor deposition (PECVD). Plasma formation is achieved by striking gases in a reaction chamber with a high voltage, low frequency radio wave, and then triggering and applying with the leading or trailing edge of the striking pulse, a second high frequency, low power radio wave. The plasma transfers energy into reactant gases forming a thin film of silicon oxynitride (Si.sub.x O.sub.y N.sub.z) onto a semiconductor substrate. The high frequency pulses provides more efficient gas ionization and less pattern, and back oxide sensitivity to film deposition rate.
Claims16
In the deposition of a thin film of silicon oxynitride onto a semiconductor substrate or layer formed on the semiconductor substrate by means of glow discharge or plasma in a reaction chamber, an improved method comprising:
- generating a first radio frequency pulse;
- striking a gas in a reaction chamber with said first pulse;
- generating a second radio frequency pulse being of higher frequency than said first pulse;
- applying said second pulse to said gas while said first pulse is still being generated;
- switching off said first pulse after a first predetermined span of time while said second pulse is still being generated;
- switching off said second pulse after a second predetermined span of time;
- repeating said pulses after a third predetermined span of time over a deposition period thereby generating a series of periodic pulses.
In the use of plasma or glow discharge to transfer energy into reactant gases so as to deposit silicon oxynitride onto semiconductor substrate or onto a layer formed on the semiconductor substrate in a reaction chamber, an improved method comprising:
- generating a first radio frequency pulse with a frequency of approximately 55 KHz;
- striking a gas in said reaction chamber with said first pulse;
- applying a second radio frequency pulse to said gas while said first pulse is still being generated, said second pulse being generated at a frequency of approximately 13.56 MKz;
- switching off said first pulse after a first predetermined span of time while said second pulse is still being generated;
- switching off said second pulse after a second perdetermined span of time;
- repeating said pulses after a third predetermined span of time over a deposition period thereby generating a series of periodic pulses.
In the use of a radio frequency field to form glow discharge or a plasma in reaction chamber so as to transfers energy to reactant gases wherein silicon oxynitride is deposited onto a semiconductor substrate or on a layer formed on the semiconductor substrate, an improved method comprising:
- generating a first radio frequency pulse of a first frequency and of a first pulse width;
- striking a gas in said reaction chamber with said first pulse;
- triggering a second radio frequency pulse with the leading edge of said first pulse;
- generating said second pulse at a second frequency and a second pulse width, said first frequency being lower than said second frequency, and said second pulse width being greater than said first pulse width;
- repeating said pulses over a predetermined deposition period thereby generating a series of periodic pulses.
In the use of plasma or glow discharge to transfer energy into reactant gases to deposit silicon oxynitride onto a semiconductor substrate or on a layer formed on the semiconductor substrate in a reaction chamber, an improved method comprising:
- generating a first radio frequency pulse of a first frequency and of a first pulse width;
- striking gas in said reaction chamber with said first pulse;
- triggering a second radio frequency pulse with the trailing edge of said first pulse;
- generating said second pulse at a second frequency and a second pulse width, said first frequency being lower than said second frequency, and said second pulse width being greater than said first pulse width;
- repeating said pulses over a predetermined deposition period thereby generating a series of periodic pulses.
In the use of a radio frequency field to form glow discharge or a plasma in a reaction chamber so as to transfer energy to reactant gases wherein silicon oxynitride is deposited onto a semiconductor substrate or on a layer formed on the semiconductor substrate, an improved method comprising:
- generating a first radio frequency pulse;
- striking a gas in said reaction chamber with said first pulse;
- triggering a second radio frequency pulse with the trailing edge of said first pulse;
- generating a third radio frequency pulse after said second pulse;
- said first and third pulse being of the same radio frequency and being lower in frequency than said second pulse;
- repeating said pulses over a predetermined deposition period thereby generating a series of periodic pulses.
Dependencies are inferred from the claim text.