H01J 2237/3328
Adhesion, stress, lift-off of deposited films
Official title: adhesion, stress, lift-off of deposited films
H01J2237/3328 (Adhesion, stress, lift-off of deposited films) appears on 27 US grants and 19 published applications in this corpus.
Search patents in H01J- Granted patents
- 27
- Published applications
- 19
- Assignees
- 16
- Inventors
- 57
- Latest grant
- 24 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 2 |
| 2015 | 1 | 4 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 4 | 1 |
| 2019 | 6 | 2 |
| 2020 | 3 | 2 |
| 2021 | 2 | 0 |
| 2022 | 1 | 2 |
| 2023 | 0 | 1 |
| 2024 | 2 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Surface modification for metal-containing photoresist deposition24 Mar 2026US 12,586,765 B2Lam Research Corporation
- Member for plasma processing device and plasma processing device provided with same20 Aug 2024US 12,065,727 B2KYOCERA Corporation
- Common substrate and shadow ring lift apparatus23 Jan 2024US 11,881,375 B2APPLIED Materials.Inc.
- Thermal spraying method of component for plasma processing apparatus and component for plasma processing apparatus10 May 2022US 11,328,905 B2Tokyo Electron Limited
- Roll to roll fabrication apparatus for preventing thermal impact18 May 2021US 11,008,656 B2LG Display Co., Ltd.
- Plasma-assisted film removal for wafer fabrication18 Jul 2024US 2024/0242939 A1Micron Technology, Inc.
- Surface modification for metal-containing photoresist deposition20 Jul 2023US 2023/0230811 A1Lam Research Corporation
- Common substrate and shadow ring lift apparatus20 Oct 2022US 2022/0336182 A1APPLIED Materials.Inc.
- Member for plasma processing device and plasma processing device provided with same10 Feb 2022US 2022/0042161 A1KYOCERA Corporation
- Bevel peeling and defectivity solution for substrate processing19 Nov 2020US 2020/0365404 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Pulsed dual radio frequency CVD process568US 4,837,185 AIntel Corporation · 1989
- Plasma source and methods for depositing thin film coatings using plasma enhanced chemical vapor deposition32US 8,652,586 B2Agc Flat Glass North America, Inc. · 2014
- Electrical contact apparatus for use with plasma or glow discharge reaction chamber13US 4,917,044 AIntel Corporation · 1990
- Method for forming a gap filling refractory metal layer having reduced stress11US 6,271,129 B1APPLIED Materials.Inc. · 2001
- Plasma source and methods for depositing thin film coatings using plasma enhanced chemical vapor deposition11US 9,478,401 B2Agc Flat Glass North America, Inc. · 2016