US 12,749,655 B2 · Splitter circuit for wafer processing system

Abstract

The present disclosure describes a semiconductor wafer processing system that uses a splitter circuit to delivery RF power from a power supply to multiple process chambers. The wafer processing system includes a first process chamber, a second process chamber, a power supply, a match circuit, and a splitter circuit. The power supply produces an electric current. The match circuit receives the electric current from the power supply and presents an impedance to the power supply. The splitting circuit includes a first leg and a second leg. The first leg includes a first capacitor that directs a first portion of the electric current from the match circuit to the first process chamber. The second leg includes a second capacitor that directs a second portion of the electric current from the match circuit to the second process chamber.

Claims20

Dependent claims

A wafer processing system comprising:

a first process chamber;
a second process chamber;
a power supply arranged to produce an electric current;
a match circuit arranged to receive the electric current from the power supply and to present an impedance to the power supply;
and
a splitter circuit comprising:
a first leg comprising a first capacitor, wherein the first leg is arranged to direct a first portion of the electric current from the match circuit to the first process chamber;
and
a second leg comprising a second capacitor, wherein the second leg is arranged to direct a second portion of the electric current from the match circuit to the second process chamber.

6 more elements

Dependencies are inferred from the claim text.

Splitter circuit for wafer processing system

Life of this patent

Splitter circuit for wafer processing system

Life of this patent

Abstract

Claims20