H01J 2237/2007
Holding mechanisms
H01J2237/2007 (Holding mechanisms) appears on 665 US grants and 1,047 published applications in this corpus.
Search patents in H01J- Granted patents
- 665
- Published applications
- 1,047
- Assignees
- 217
- Inventors
- 2,051
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 4 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 2 |
| 2003 | 2 | 3 |
| 2004 | 2 | 3 |
| 2005 | 5 | 5 |
| 2006 | 4 | 6 |
| 2007 | 5 | 14 |
| 2008 | 7 | 17 |
| 2009 | 8 | 14 |
| 2010 | 13 | 12 |
| 2011 | 8 | 17 |
| 2012 | 13 | 13 |
| 2013 | 18 | 17 |
| 2014 | 21 | 20 |
| 2015 | 24 | 41 |
| 2016 | 30 | 30 |
| 2017 | 25 | 19 |
| 2018 | 18 | 20 |
| 2019 | 19 | 23 |
| 2020 | 23 | 43 |
| 2021 | 16 | 96 |
| 2022 | 50 | 125 |
| 2023 | 51 | 130 |
| 2024 | 89 | 121 |
| 2025 | 111 | 158 |
| 2026 | 81 | 97 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- External cooling assembly for substrate support6 Oct 2026US 12,755,943 B2APPLIED Materials.Inc.
- Electrostatically secured substrate support assembly6 Oct 2026US 12,755,944 B2APPLIED Materials.Inc.
- Substrate fixing device6 Oct 2026US 12,757,684 B2Shinko Electric Industries Co., Ltd.
- Enhanced dry desmear equipment with protective film peeling capability for integrated circuits29 Sep 2026US 12,749,660 B2Intel Corporation
- Supporting unit and apparatus for treating substrate29 Sep 2026US 12,749,662 B2Semes Co., Ltd.
- Porous plug assembly, electrostatic chuck, and plasma etching apparatus1 Oct 2026US 2026/0305249 A1Advanced Micro-Fabrication Equipment Inc. China
- Temperature control member and electrostatic chuck device1 Oct 2026US 2026/0305250 A1Sumitomo Osaka Cement Co., Ltd.
- Plug and member for semiconductor manufacturing apparatus24 Sep 2026US 2026/0290756 A1NGK Corporation
- Wafer edge profile control using connected edge ring hardware24 Sep 2026US 2026/0290771 A1APPLIED Materials.Inc.
- Encapsulated metal pedestal17 Sep 2026US 2026/0279741 A1Lam Research Corporation
Most cited
By later US patents
- Method for separating specimen and method for analyzing the specimen separated by the specimen separating method131US 5,270,552 AHitachi, Ltd. · 1993
- Low-inertia multi-axis multi-directional mechanically scanned ion implantation system78US 8,227,768 B2Axcelis Technologies, Inc. · 2012
- Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using former61US 6,855,929 B2Ebara Corporation · 2005
- Real time monitoring with closed loop chucking force control47US 10,460,916 B2APPLIED Materials.Inc. · 2019
- Support table for plate-like body and processing apparatus using the table44US 5,221,403 AKabushiki Kaisha Toshiba · 1993