Porous plug assembly, electrostatic chuck, and plasma etching apparatus

Abstract

Disclosed are a porous plug assembly, an electrostatic chuck, and a plasma etching apparatus. The porous plug assembly includes a porous plug body with a porous structure, wherein a gas enters from a bottom surface of the porous plug body, passes through the porous plug body, and flows out from a top surface of the porous plug body; and an insulating dense layer, including a lateral portion and a transverse portion, wherein the lateral portion is formed on a side wall of the porous plug body, and the transverse portion at least extends toward one of a direction away from the porous plug body and a direction close to the porous plug body from a top end of the lateral portion. The transverse portion reduces the risk that a bonding layer is eroded by a plasma. The porous plug assembly further reduces the discharge space and the risk of generating arching. The porous plug assembly further effectively solves the problem that the bonding layer blocks the porous plug body.

Dependencies are inferred from the claim text.