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US 12,757,684 B2Granted
Substrate fixing device
AssigneeShinko Electric Industries Co., Ltd.
InventorsYuma Terashima, Shun Takagi, Keita Sato, Yohei Yamada, Yuta Naito
Life of this patent
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Abstract
A substrate fixing device includes a base plate, an adhesive layer provided on the base plate, a heat insulating layer provided on the adhesive layer, and an electrostatic chuck provided on the heat insulating layer. The electrostatic chuck includes a base and an electrostatic electrode provided in the base, and the heat insulating layer has a lower thermal conductivity than the base and the adhesive layer.
Claims6
A substrate fixing device comprising:
- a base plate;
- an adhesive layer provided on the base plate;
- a heat insulating layer provided on the adhesive layer;
- an electrostatic chuck provided on the heat insulating layer;
- an insulating resin layer provided between the base layer and the heat insulating layer;
- and
- a heating element provided in the insulating resin layer,
- wherein the electrostatic chuck includes a base and an electrostatic electrode provided in the base,
- wherein the heat insulating layer has a lower thermal conductivity than the base and the adhesive layer,
- wherein the heat insulating layer has a lower thermal conductivity than the insulating resin layer, and
- wherein the heating element is not exposed from the upper surface of the insulating resin layer.
8 more elements
Dependencies are inferred from the claim text.