H01J 2237/0041
Neutralising arrangements
H01J2237/0041 (Neutralising arrangements) appears on 386 US grants and 366 published applications in this corpus.
Search patents in H01J- Granted patents
- 386
- Published applications
- 366
- Assignees
- 140
- Inventors
- 908
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 5 | 0 |
| 1995 | 9 | 0 |
| 1996 | 6 | 0 |
| 1997 | 5 | 0 |
| 1998 | 6 | 0 |
| 1999 | 5 | 0 |
| 2000 | 8 | 0 |
| 2001 | 9 | 1 |
| 2002 | 9 | 11 |
| 2003 | 17 | 6 |
| 2004 | 12 | 15 |
| 2005 | 13 | 12 |
| 2006 | 8 | 19 |
| 2007 | 12 | 13 |
| 2008 | 15 | 16 |
| 2009 | 11 | 17 |
| 2010 | 15 | 17 |
| 2011 | 13 | 18 |
| 2012 | 12 | 12 |
| 2013 | 21 | 11 |
| 2014 | 23 | 14 |
| 2015 | 13 | 15 |
| 2016 | 7 | 14 |
| 2017 | 8 | 12 |
| 2018 | 15 | 17 |
| 2019 | 15 | 21 |
| 2020 | 20 | 18 |
| 2021 | 11 | 12 |
| 2022 | 11 | 12 |
| 2023 | 12 | 14 |
| 2024 | 11 | 14 |
| 2025 | 7 | 23 |
| 2026 | 9 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Fiber Fabry-Perot Cavity laser phase plate for charged particle microscopy1 Sep 2026US 12,725,756 B2FEI Company
- System and method for plasma processing18 Aug 2026US 12,712,152 B2Tokyo Electron Limited
- Method, apparatus, and system for wafer grounding28 Jul 2026US 12,696,725 B2ASML Netherlands B. V.
- Semiconductor wafer processing method2 Jun 2026US 12,648,404 B2Hitachi High-Tech Corporation
- Member for semiconductor manufacturing apparatus7 Apr 2026US 12,598,952 B2NGK Insulators, Ltd.
- Multi-beam charged particle microscope for inspection with reduced charging effects17 Sep 2026US 2026/0279715 A1
- Reactor design optimization with dc bias pulsing to pedestal30 Jul 2026US 2026/0221397 A1Lam Research Corporation
- Semiconductor manufacturing apparatus including reflector2 Jul 2026US 2026/0188604 A1Samsung Electronics Co., Ltd.
- Electron emission source18 Jun 2026US 2026/0171342 A1Infovion Inc.
- Object table comprising an electrostatic clamp18 Jun 2026US 2026/0171932 A1ASML Netherlands B. V.
Most cited
By later US patents
- Neutral beam-assisted atomic layer chemical vapor deposition apparatus and method of processing substrate using the same425US 7,799,706 B2Sungkyunkwan University Foundation for Corporate Collaboration · 2010
- Enhanced reactive DC sputtering system162US 5,718,813 AAdvanced Energy Industries, Inc. · 1998
- Plasma immersion ion implantation (PI.sup.3) apparatus149US 5,354,381 AVarian Associates, Inc. · 1994
- Thin film DC plasma processing system131US 5,427,669 AAdvanced Energy Industries, Inc. · 1995
- Low energy, steered ion beam deposition system having high current at low pressure116US 5,206,516 AInternational Business Machines Corporation · 1993