Method, apparatus, and system for wafer grounding

A method for grounding a wafer, the method comprising:

• receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal;
• determining a first control parameter using at least the first value;
• controlling a characteristic of the electric signal using the first control parameter and the first value;
• and
• wherein the electric characteristic comprises at least one of an impedance, a resistance, a capacitive reactance, an admittance, a conductance, or a capacitive susceptance.

A system for grounding a wafer, the system comprising:

• a sensor configured to generate a first value of an electric characteristic associated with the wafer being grounded by an electric signal;
• an electric signal generator configured to generate the electric signal;
• and
• a controller including circuitry for receiving the first value of the electric characteristic, determining a first control parameter based on a comparison of the first value and a target value of the electric characteristic, and controlling a characteristic of the electric signal using the first control parameter and the first value.