Member for semiconductor manufacturing apparatus

A member for semiconductor manufacturing apparatus comprising:

• a ceramic plate that has an upper surface including a wafer placement surface including a reference surface on which multiple small projections for supporting a wafer are provided and that contains an electrostatic electrode;
• a plug arrangement hole that extends in an up-down direction and that is provided in the ceramic plate;
• an electrostatic electrode opening portion that is provided at a position in the electrostatic electrode through which the plug arrangement hole extends and that has a diameter equal to or larger than that of the plug arrangement hole;
• a cooling plate that is provided on a lower surface of the ceramic plate;
• a gas hole that extends through the cooling plate in the up-down direction and that is in communication with the plug arrangement hole;
• a plug that is arranged in the plug arrangement hole and that includes a gas flow path through which heat conduction gas is to flow in the up-down direction;
• and
• a raised portion that surrounds the gas flow path and that has a top surface higher than the reference surface and lower than top surfaces of the small projections,
• wherein the raised portion and the ceramic plate are a one-piece.