G11C 29/80
With improved layout
Official title: {with improved layout}
G11C29/80 (With improved layout) appears on 2,193 US grants and 1,799 published applications in this corpus.
Search patents in G11C- Granted patents
- 2,193
- Published applications
- 1,799
- Assignees
- 369
- Inventors
- 2,995
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 4 | 0 |
| 1988 | 9 | 0 |
| 1989 | 7 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 7 | 0 |
| 1993 | 23 | 0 |
| 1994 | 37 | 0 |
| 1995 | 31 | 0 |
| 1996 | 56 | 0 |
| 1997 | 56 | 0 |
| 1998 | 77 | 0 |
| 1999 | 86 | 0 |
| 2000 | 80 | 0 |
| 2001 | 67 | 32 |
| 2002 | 82 | 74 |
| 2003 | 87 | 92 |
| 2004 | 69 | 91 |
| 2005 | 74 | 85 |
| 2006 | 79 | 85 |
| 2007 | 79 | 75 |
| 2008 | 81 | 82 |
| 2009 | 62 | 76 |
| 2010 | 62 | 66 |
| 2011 | 68 | 64 |
| 2012 | 48 | 74 |
| 2013 | 69 | 87 |
| 2014 | 99 | 106 |
| 2015 | 112 | 82 |
| 2016 | 75 | 42 |
| 2017 | 65 | 43 |
| 2018 | 47 | 47 |
| 2019 | 52 | 69 |
| 2020 | 59 | 62 |
| 2021 | 53 | 63 |
| 2022 | 55 | 63 |
| 2023 | 53 | 34 |
| 2024 | 46 | 42 |
| 2025 | 35 | 36 |
| 2026 | 15 | 127 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- G11C 29/816For an application-specific layout853
- G11C 29/808Using a flexible replacement scheme765
- G11C 29/802By encoding redundancy signals209
- G11C 29/81Using a hierarchical redundancy scheme187
- G11C 29/812Using a reduced amount of fuses128
- G11C 29/804To prevent clustered faults89
- G11C 29/806By reducing size of decoders85
- G11C 29/814For optimized yield52
Recent patents
- Partial array sparing in a memory22 Sep 2026US 12,744,105 B2International Business Machines Corporation
- Cycling replacement blocks based on a die wafer location15 Sep 2026US 12,738,341 B2Micron Technology, Inc.
- Memory device and repair method of the memory device9 Jun 2026US 12,651,641 B2Samsung Electronics Co., Ltd.
- Methods for fabricating 3D memory devices and structures with memory arrays and metal layers9 Jun 2026US 12,653,021 B2Monolithic 3D Inc.
- Self-repairable chip for silent data corruption issues14 Apr 2026US 12,602,298 B2Google Inc.
- Stacked die memory sparing device and method17 Sep 2026US 2026/0282847 A1Micron Technology, Inc.
- Method for lut-free memory repair27 Aug 2026US 2026/0253660 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Targeted Jet-Cooling System for Zetta-Scale Computing Assemblies16 Jul 2026US 2026/0202891 A1
Most cited
By later US patents
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- Highly compact EPROM and flash EEPROM devices819US 5,095,344 A1992
- Flash eeprom system602US 5,297,148 ASunDisk Corporation · 1994
- Flash EEPROM memory systems having multistate storage cells579US 5,043,940 A1991
- Flash EEprom system524US 5,602,987 ASanDisk Corporation · 1997