Cycling replacement blocks based on a die wafer location
AssigneeMicron Technology, Inc.
InventorsTawalin Opastrakoon, Sean Brasfield, Chonggiap Chiew
Life of this patent
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Abstract
A technique is disclosed for cycling replacement blocks based on die wafer location data. The die wafer location data can provide a die location failure value for each die of a memory device. Each die location failure value can indicate a likelihood of die failure during operation of the memory device. A die of the memory device can be identified as a high-risk die corresponding to a die of the memory device as most likely to experience a die failure based on the die wafer location data. One or more reserved blocks of the high-risk die can be identified. The reserved blocks of the high-risk die can be cycled.
Claims20
A method comprising:
- retrieving, by a controller, die wafer location data, the die wafer location data providing a die location failure value for each die of a memory device, each die location failure value indicating a likelihood of die failure during operation of the memory device;
- identifying, by the controller, a die of the memory device as a high-risk die corresponding to a die of the memory device as most likely to experience a die failure during operation of the memory device based on the die wafer location data;
- identifying, by the controller, a reserved block of the high-risk die;
- and
- cycling, by the controller, the reserved block of the high-risk die.
A system for cycling a reserved block of a memory device comprising dies, a respective die of the dies including the replacement block, the system comprising:
- a processing device coupled to the memory device, the processing device to perform operations comprising:
- identifying a respective die of the dies as a high-risk die corresponding to a die of the memory device as most likely to experience a die failure during operation of the memory device based on die wafer location data;
- and
- cycling the reserved block of the high-risk die in response to the identifying.
A non-transitory computer-readable storage medium comprising instructions that, when executed by a processing device, cause the processing device to perform operations comprising:
- retrieving die wafer location data from a memory, the die wafer location data providing a die location failure value for each die of a memory device indicating a likelihood of die failure during operation of the memory device;
- identifying a die of the memory device as a high-risk die corresponding to a die of the memory device as most likely to experience a die failure during operation of the memory device based on the retrieved die wafer location data;
- identifying a reserved block of the high-risk die;
- and
- cycling the reserved block of the high-risk die.
Dependencies are inferred from the claim text.