G11C 29/81
Using a hierarchical redundancy scheme
Official title: {using a hierarchical redundancy scheme}
G11C29/81 (Using a hierarchical redundancy scheme) appears on 187 US grants and 175 published applications in this corpus.
Search patents in G11C- Granted patents
- 187
- Published applications
- 175
- Assignees
- 71
- Inventors
- 312
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 6 | 0 |
| 2000 | 7 | 0 |
| 2001 | 3 | 2 |
| 2002 | 4 | 3 |
| 2003 | 8 | 8 |
| 2004 | 5 | 7 |
| 2005 | 2 | 3 |
| 2006 | 4 | 3 |
| 2007 | 5 | 6 |
| 2008 | 5 | 4 |
| 2009 | 5 | 6 |
| 2010 | 1 | 5 |
| 2011 | 5 | 2 |
| 2012 | 4 | 6 |
| 2013 | 2 | 4 |
| 2014 | 4 | 2 |
| 2015 | 1 | 1 |
| 2016 | 1 | 0 |
| 2017 | 3 | 2 |
| 2018 | 5 | 7 |
| 2019 | 7 | 14 |
| 2020 | 10 | 10 |
| 2021 | 13 | 19 |
| 2022 | 17 | 23 |
| 2023 | 14 | 11 |
| 2024 | 20 | 12 |
| 2025 | 8 | 5 |
| 2026 | 4 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Partial array sparing in a memory22 Sep 2026US 12,744,105 B2International Business Machines Corporation
- Memory system and data processing system including the same10 Feb 2026US 12,547,510 B2SK hynix Inc.
- Redundancy and swapping scheme for memory repair3 Feb 2026US 12,541,440 B2Micron Technology, Inc.
- Memory with post-packaging master die selection13 Jan 2026US 12,524,342 B2Micron Technology, Inc.
- Method and system for repairing a dynamic random access memory (dram) of memory device30 Dec 2025US 12,512,180 B2Samsung Electronics Co., Ltd.
- Repair Sharing In Serial Repair Interfaces25 Jun 2026US 2026/0179710 A1Google Inc.
- Memory-paired system for multiple stacked semiconductor devices and repair method thereof25 Jun 2026US 2026/0179716 A1Nanya Technology Corporation
- Apparatuses, systems, and methods for mapping repair addresses for a memory device11 Jun 2026US 2026/0162752 A1Micron Technology, Inc.
- Apparatuses and methods for redundancy information for memory with multiple storage modes11 Jun 2026US 2026/0162754 A1Micron Technology, Inc.
- Redundancy and swapping scheme for memory repair28 May 2026US 2026/0147676 A1Micron Technology, Inc.
Most cited
By later US patents
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- Three dimensional structure memory213US 6,208,545 B12001
- Three-dimensional structure memory189US 6,133,640 AElm Technology Corporation · 2000
- Fault-tolerant hierarchical bus system and method of operating same138US 5,666,480 AMonolithic System Technology, Inc. · 1997
- Defect tolerant integrated circuit subsystem for communication between a module and a bus controller in a wafer-scale integrated circuit system126US 5,592,632 AMonolithic System Technology, Inc. · 1997