Memory-paired system for multiple stacked semiconductor devices and repair method thereof
AssigneeNanya Technology Corporation
InventorsDa-Zen CHUANG, Pin-Hsiu HSIEH
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AssigneeNanya Technology Corporation
InventorsDa-Zen CHUANG, Pin-Hsiu HSIEH
Estimating the term…
This invention provides a memory-paired system for multiple stacked semiconductor devices and its repair method. The memory-paired system has a paired unit having at least two chips that are identical design. Each of the at least two chips of the paired unit has a memory resources module configured for deploying memory resources for repair and a paired control module configured for executing allocation of memory resources by sending a request to another one chip of the at least two chips of the paired unit when memory resource of the memory resource module that the request points have been allocated, or providing spare memory resource of the memory resource module to one chip of the paired unit based on a request from the one chip that has a failed unit existing, so the spare memory resource of the memory resource module repairs the failed unit of the one chip.
A repair method for multiple stacked semiconductor devices, comprising:
A memory-paired system for multiple stacked semiconductor devices, comprising:
Dependencies are inferred from the claim text.