G03F 7/706841
Machine learning
Official title: {Machine learning}
G03F7/706841 (Machine learning) appears on 32 US grants and 115 published applications in this corpus.
Search patents in G03F- Granted patents
- 32
- Published applications
- 115
- Assignees
- 24
- Inventors
- 374
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2019 | 0 | 1 |
| 2020 | 0 | 1 |
| 2021 | 1 | 2 |
| 2022 | 2 | 6 |
| 2023 | 3 | 19 |
| 2024 | 5 | 28 |
| 2025 | 8 | 36 |
| 2026 | 13 | 22 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Machine learning based metrology for semiconductor specimens6 Oct 2026US 12,754,484 B2Applied Materials Israel Ltd.
- Process proximity effect correction method and process proximity effect correction device25 Aug 2026US 12,717,225 B2Samsung Electronics Co., Ltd.
- Method of obtaining array of plurality of regions on substrate, exposure method, exposure apparatus, method of manufacturing article, non-transitory computer-readable storage medium, and information processing apparatus28 Jul 2026US 12,693,604 B2Canon Kabushiki Kaisha
- Time-domain optical metrology and inspection of semiconductor devices14 Jul 2026US 12,680,964 B2Nova Ltd.
- Corner rounding method of OPC pattern based on deep learning, and OPC method and mask manufacturing method including the corner rounding method14 Jul 2026US 12,681,379 B2Samsung Electronics Co., Ltd.
- Metrology method and associated metrology and lithographic apparatuses24 Sep 2026US 2026/0288017 A1ASML Netherlands B. V.
- Image preprocessing method for detecting an abnormality24 Sep 2026US 2026/0288018 A1
- Systems and methods for multi-task baseline models in semiconductor metrology and inspection applications27 Aug 2026US 2026/0251983 A1Gauss Labs Inc.
- Method and system for selecting patterns based on similarity metric13 Aug 2026US 2026/0235965 A1ASML Netherlands B. V.
- Apparatus and method for predicting aerial images in semiconductor lithography processes16 Jul 2026US 2026/0202759 A1Seoul National University R&Db Foundation
Most cited
By later US patents
- Automatic optimization of an examination recipe2US 11,307,150 B2Applied Materials Israel Ltd. · 2022
- Method to predict yield of a device manufacturing process1US 11,086,229 B2ASML Netherlands B. V. · 2021
- Determination of defect location for examination of a specimen1US 11,423,529 B2Applied Materials, Isreal, Ltd. · 2022
- Estimating in-die overlay with tool induced shift correction1US 12,181,271 B2KLA Corporation · 2024
- Method of forming optical proximity correction model and method of fabricating semiconductor device using the same1US 12,354,920 B2Samsung Electronics Co., Ltd. · 2025