Metrology method and associated metrology and lithographic apparatuses

Abstract

Disclosed is a method of metrology relating to measurement of a structure on a substrate, said structure being subject to process variation. The method comprises obtaining first measurement data relating to a phase of measurement radiation having been scattered from one or more marks, and relating to a plurality of measurement conditions; obtaining second measurement data relating to an intensity of said measurement radiation and relating to said plurality of measurement conditions; obtaining a weighting for said first measurement data and second measurement data, said weighting comprising a modulus component relating to a modulus of complex weights and an argument component relating to an argument of the complex weights; and determining a first parameter value for a first parameter from said first measurement data and said second measurement data, as weighted by said weighting.

Dependencies are inferred from the claim text.