G03F 7/70608
Monitoring the unpatterned workpiece
Official title: {Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist}
G03F7/70608 (Monitoring the unpatterned workpiece) appears on 201 US grants and 246 published applications in this corpus.
Search patents in G03F- Granted patents
- 201
- Published applications
- 246
- Assignees
- 73
- Inventors
- 511
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 2 |
| 2003 | 3 | 5 |
| 2004 | 6 | 4 |
| 2005 | 4 | 13 |
| 2006 | 4 | 6 |
| 2007 | 8 | 7 |
| 2008 | 6 | 13 |
| 2009 | 6 | 10 |
| 2010 | 7 | 9 |
| 2011 | 6 | 7 |
| 2012 | 8 | 7 |
| 2013 | 5 | 7 |
| 2014 | 7 | 8 |
| 2015 | 6 | 7 |
| 2016 | 8 | 6 |
| 2017 | 10 | 7 |
| 2018 | 6 | 5 |
| 2019 | 8 | 15 |
| 2020 | 12 | 19 |
| 2021 | 14 | 18 |
| 2022 | 9 | 18 |
| 2023 | 16 | 19 |
| 2024 | 16 | 11 |
| 2025 | 12 | 14 |
| 2026 | 6 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Quasi-dynamic in situ ellipsometry method and system for measuring photoresist exposure process8 Sep 2026US 12,730,383 B2Huazhong University of Science and Technology
- Inspection method, method for producing composition, and method for verifying composition25 Aug 2026US 12,717,245 B2FUJIFILM Corporation
- Method for particle beam-induced processing of a defect of a microlithographic photomask7 Jul 2026US 12,676,283 B2Carl Zeiss SMT GmbH
- Exposure mask16 Jun 2026US 12,656,672 B2VisEra Technologies Company Limited
- Wafer treatment method7 Apr 2026US 12,598,958 B2Nissan Chemical Corporation
- Alignment method and associated alignment and lithographic apparatuses10 Sep 2026US 2026/0267235 A1ASML Netherlands B. V.
- Controlled Environment Photoresist Processing System and Method20 Aug 2026US 2026/0244113 A1
- Lithographic apparatus and inspection system for measuring wafer deformation16 Jul 2026US 2026/0202191 A1ASML Netherlands B. V.
- Method for particle beam-induced processing of a defect of a microlithographic photomask16 Jul 2026US 2026/0204510 A1Carl Zeiss SMT GmbH
- Resist pattern inspection method, resist pattern manufacturing method, substrate selection method, and manufacturing method for semiconductor package substrate or printed circuit board2 Jul 2026US 2026/0186422 A1
Most cited
By later US patents
- Method and apparatus for the determination of mask rules using scatterometry92US 6,433,878 B1Timbre Technology, Inc. · 2002
- Methods and scatterometers, lithographic systems, and lithographic processing cells70US 9,081,303 B2ASML Netherlands B. V. · 2015
- Inspection apparatus for lithography63US 8,792,096 B2ASML Netherlands B. V. · 2014
- Method and apparatus for measuring lateral variations in thickness or refractive index of a transparent film on a substrate43US 6,801,321 B1Tevet Process Control Technologies Ltd. · 2004
- Exposure apparatus and method for a semiconductor wafer42US 5,526,093 ACanon Kabushiki Kaisha · 1996