Exposure apparatus and method for a semiconductor wafer
AssigneeCanon Kabushiki Kaisha
InventorKazuhiro Takahashi
Life of this patent
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Abstract
An exposure apparatus including a scanner for scanning a substrate to be exposed with an exposure beam; and an exposure amount controller for controlling an amount of exposure by the exposure beam in accordance with a position on the substrate. An exposure apparatus including a scanner for scanning a substrate to be exposed with an exposure beam; a detector for detecting a distribution of a film thickness of a radiation sensitive layer on the substrate; and an exposure amount changing controller for controlling an amount of exposure by the exposure beam in accordance with the film thickness distribution.
Claims40
An exposure apparatus comprising:
- means for directing an exposure beam to a substrate to be exposed, through a a mask;
- means for scanning the mask and the substrate with the exposure beam, said scanning means comprising a mask stage for holding the mask and a scanning stage for carrying the substrate, said mask stage moving in synchronism with movement of said scanning stage;
- and
- exposure amount changing means for changing an amount of exposure by the exposure beam in accordance with a position on the substrate.
An exposure apparatus comprising:
- means for scanning a substrate to be exposed with an exposure beam, said scanning means comprising a light source for supplying pulsewise light;
- and
- exposure amount changing means for changing an amount of exposure by the exposure beams in accordance with a position on the substrate.
An exposure apparatus comprising:
- scanning means for scanning a substrate to be exposed with an exposure beam, said scanning means comprising a scanning stage for carrying the substrate;
- and
- exposure amount changing means for changing an amount of exposure by the exposure beam in accordance with a position on the substrate, said exposure amount changing means comprising means for changing a speed of said scanning stage.
An exposure apparatus comprising:.
- scanning means for scanning a substrate to be exposed with an exposure beam;
- and
- exposure amount changing means for changing an amount of exposure by the exposure beam in accordance with a position on the substrate, said exposure amount changing means changing the exposure amount in accordance with a film thickness distribution of a radiation sensitive layer on the substrate.
An exposure apparatus comprising:
- means for scanning a substrate to be exposed with an exposure beam;
- means for detecting a distribution of a film thickness of a radiation sensitive layer on the substrate;
- and
- exposure amount changing means for changing an amount of exposure by the exposure beam in accordance with the film thickness distribution.
An exposure apparatus comprising:
- means for directing an exposure beam to an object to be exposed through a mask and for scanning the mask and the object with the exposure beam;
- and
- means for changing an amount of exposure by the exposure beam in accordance with a position on the object.
An exposure apparatus comprising:
- means for scanning an object to be exposed with an exposure beam;
- and
- means for changing an amount of exposure by the exposure beam, by changing a speed of the scanning, in accordance with a position on the object.
An exposure apparatus comprising:
- means for scanning an object to be exposed with an exposure beam;
- and
- means for changing an amount of exposure by the exposure beam in accordance with a film thickness distribution of a radiation sensitive layer on the object.
An exposure apparatus comprising:
- means for scanning an object to be exposed with pulsewise light from a light source;
- and
- means for changing an amount of the exposure by the pulsewise light in accordance with a position on the object.
A device manufacturing method including printing a device pattern on a workpiece by scanning the workpiece with an exposure beam, said method comprising:
- directing an exposure beam to an object to be exposed through a mask and for scanning the mask and the object with the exposure beam;
- and
- changing an amount of exposure by the exposure beam in accordance with a position on the object.
A device manufacturing method including printing a device pattern on a workpiece by scanning the workpiece with an exposure beam, said method comprising:
- scanning an object to be exposed with an exposure beam;
- and
- changing an amount of exposure by the exposure beam, by changing a speed of the scanning, in accordance with a position on the object.
A device manufacturing method including printing a device pattern on a workpiece by scanning the workpiece with an exposure beam, said method comprising:
- scanning an object to be exposed with an exposure beam;
- and
- changing an amount of exposure by the exposure beam in accordance with a film thickness distribution of a radiation sensitive layer on the object.
A device manufacturing method including printing a device pattern on a workpiece by scanning the workpiece with an exposure beam, said method comprising:
- scanning an object to be exposed with pulsewise light from a light source;
- and
- changing an amount of the exposure by the pulsewise light in accordance with a position on the object.
A device manufacturing method including printing a device pattern on a workpiece by scanning the workpiece with an exposure beam, said method comprising:
- detecting a distribution of a film thickness of a radiation sensitive layer on the workpiece;
- and
- changing an amount of exposure by the exposure beam in accordance with the film thickness distribution detected in said detecting step.
Dependencies are inferred from the claim text.