G03F 7/2028
Of an edge bead on wafers
Official title: {of an edge bead on wafers}
G03F7/2028 (Of an edge bead on wafers) appears on 86 US grants and 104 published applications in this corpus.
Search patents in G03F- Granted patents
- 86
- Published applications
- 104
- Assignees
- 59
- Inventors
- 259
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 3 | 7 |
| 2003 | 5 | 8 |
| 2004 | 6 | 4 |
| 2005 | 3 | 3 |
| 2006 | 2 | 6 |
| 2007 | 2 | 7 |
| 2008 | 3 | 3 |
| 2009 | 1 | 3 |
| 2010 | 4 | 1 |
| 2011 | 1 | 4 |
| 2012 | 2 | 2 |
| 2013 | 1 | 4 |
| 2014 | 3 | 1 |
| 2015 | 1 | 1 |
| 2016 | 2 | 5 |
| 2017 | 5 | 4 |
| 2018 | 5 | 5 |
| 2019 | 3 | 5 |
| 2020 | 6 | 7 |
| 2021 | 4 | 1 |
| 2022 | 2 | 3 |
| 2023 | 3 | 6 |
| 2024 | 1 | 5 |
| 2025 | 5 | 4 |
| 2026 | 3 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Processing apparatus for forming a coating film on a substrate having a camera and a mirror member17 Feb 2026US 12,557,608 B2Tokyo Electron Limited
- Exposure method and exposure apparatus13 Jan 2026US 12,523,942 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing system and substrate processing method using the same6 Jan 2026US 12,518,988 B2Samsung Electronics Co., Ltd.
- Edge exposure apparatus and light source output control method16 Dec 2025US 12,498,642 B2Semes Co., Ltd.
- Peripheral edge processing apparatus, peripheral edge processing method, and computer-readable recording medium5 Aug 2025US 12,379,200 B2Tokyo Electron Limited
- System and methods of lithographic exposure to improve etch performance and yield20 Aug 2026US 2026/0244107 A1Tokyo Electron Limited
- Composition for removing edge bead from metal containing resists, and method and system of forming patterns using the same11 Jun 2026US 2026/0161089 A1Samsung SDI.Co., Ltd.
- Processing apparatus for forming a coating film on a substrate having a camera and a mirror member21 May 2026US 2026/0144017 A1Tokyo Electron Limited
- Exposure method and exposure apparatus16 Apr 2026US 2026/0104652 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Thinner composition28 Aug 2025US 2025/0270481 A1Dongwoo Fine-Chem Co., Ltd.
Most cited
By later US patents
- Process for exposing a peripheral area of a wafer and a device for executing the process43US 5,929,976 AUshiodenki Kabushiki Kaisha · 1999
- Method of exposing a peripheral part of wafer42US 4,899,195 AUshio Denki Kabushiki Kaisha · 1990
- Exposure apparatus including two illuminating systems and exposure process using the same27US 5,359,389 ACanon Kabushiki Kaisha · 1994
- Process for exposing the peripheral area of a semiconductor wafer for removing unnecessary resist on the semiconductor wafer and a device for executing the process21US 5,880,816 AUshiodenki Kabushiki Kaisha · 1999
- Apparatus for exposing peripheral portion of substrate14US 5,229,811 ANikon Corporation · 1993