Processing apparatus for forming a coating film on a substrate having a camera and a mirror member

A substrate processing apparatus comprising:

• a coating liquid supplying unit configured to supply a coating liquid onto a surface of a process substrate;
• an irradiating unit configured to irradiate a peripheral portion of the surface of the process substrate with energy beam;
• at least one camera;
• and
• a control unit,
• wherein the control unit is configured to control the substrate processing apparatus to perform a procedure including:
• a first step that takes an image of an end face of a reference substrate, whose warp amount is known, over a whole periphery of the reference substrate by means of said at least one camera;
• a second step that performs image processing of the image taken in the first step, thereby to obtain shape data of the end face of the reference substrate over the whole periphery of the reference substrate;
• a third step that takes an image of an end face of a process substrate over a whole periphery of the process substrate by means of said at least one camera;
• a fourth step that performs image processing of the image taken in the third step, thereby to obtain shape data of the end face of the process substrate over the whole periphery of the process substrate;
• a fifth step that calculates a warp amount of the process substrate based on the shape data obtained in the second step and the shape data obtained in the fourth step;
• a sixth step that controls the coating liquid supplying unit and supplies a coating liquid to the surface of the process substrate thereby to form a coating film on the surface of the process substrate;
• a periphery exposure step that controls, after the sixth step, the irradiating unit and exposes the coating film in the peripheral portion of the surface of the process substrate at a predetermined exposure width over the whole periphery of the process substrate, and
• wherein in the periphery exposure step, the exposure width is determined based on the warp amount calculated in the fifth step.