US 5,929,976 AGranted

Process for exposing a peripheral area of a wafer and a device for executing the process

AssigneeUshiodenki Kabushiki Kaisha

InventorsIsamu Shibuya, Takeshi Minore, Yoshiki Mimura

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Abstract

A process for exposing the peripheral area of a wafer and a device for executing the process is provided to enable both step-shaped exposure and also ring-shaped exposure of part of the peripheral area of a wafer using a single arrangement. The device includes a rotary carrier for receiving a wafer having resist thereon, which is moved and rotated based on the position of the wafer on the carrier, the position of a singular point formed on an edge of the wafer, such as an "ori-fla" and the like, and furthermore alignment mark position information, to position the wafer in a stipulated position. Then, using an X-Y carrier, the rotary carrier is moved as exposure light is radiated from a first exit part to expose some of the peripheral area of the wafer in a step shape. Next, the rotary carrier is moved again and rotated, and exposure light emitted from a second exit part to expose a not yet exposed part of the peripheral area of the wafer in a ring-shape. A fiber changeover unit may be positioned and the exposure light introduced into an exit part from a single light source.

Claims7

Dependent claims

Process for exposing and irradiating, using exposure light, a peripheral area of a semiconductor wafer having a peripheral edge, which is provided with a singular shaped point, and a surface on which a photoresist is applied and a pattern is formed, said surface having unnecessary resist outside an area in which the pattern is formed, said outside area being exposed to the exposure light, comprising the steps of:

a) determining and storing position information relating to alignment marks that are formed on the semiconductor wafer;
b) placing the wafer on a rotary carrier which is positioned at a first station;
c) determining and storing the position in which the wafer is placed on the rotary carrier and the position of the singular shaped point;
d) moving the rotary carrier based on the determined and stored position in which the wafer is placed, based on the determined and stored position of the singular shaped point of the wafer and based on stored position information of the alignment marks such that the alignment marks can be determined;
e) determining and storing the positions of the alignment marks;
f) moving the rotary carrier based on the determined and stored positions of the alignment marks such that the exposure light from a first exit part for the exposure light is radiated onto a first exposure initial position on the wafer;
g) irradiating the peripheral area of the wafer with exposure light from the first exit part by moving the rotary carrier parallel to the wafer surface in orthogonally intersecting directions causing step-shaped exposure of part of the peripheral area of the wafer;
h) moving the rotary carrier from the first station to a second station and rotating the rotary carrier, based on the determined and stored position in which the wafer is placed, and based on the determined and stored position of the singular shaped point of the wafer, so that the exposure light from a second exit part is radiated onto a second exposure initial position in a not yet exposed part of the peripheral area of the wafer;
and
i) turning the rotary carrier at the second station and radiating the exposure light from the second exposure initial position onto the not yet exposed part of the wafer causing ring-shaped exposure of the peripheral area of the wafer.

7 more elements

A device for exposing a peripheral area of a semiconductor wafer to exposure light, the wafer having a surface on which a photoresist is applied, comprising:

a rotary carrier on which the wafer is placed for rotating the wafer;
an X-Y carrier for moving the rotary carrier parallel to the wafer surface and, simultaneously, in orthogonally intersecting directions;
control means for controlling operation of the rotary carrier and the X-Y carrier;
a first exit part having a first exposure light source and which is located at a first station for emitting exposure light onto the wafer on the rotary carrier, said control means causing movement of the X-Y carrier in orthogonally intersecting directions so as to expose the photoresist on a first peripheral area of the wafer in a step-shape;
and
a second exit part having a first exposure light source and which is located at a second station for radiating the exposure light onto the wafer on the rotary carrier, said control means causing rotation of the rotary carrier so as to expose the photoresist on a second peripheral area of the wafer in a ring-shape after producing movement of said X-Y carrier causing said rotary carrier to be displaced from said first station to said second station.

3 more elements

A device for exposing a peripheral area of a semiconductor wafer to exposure light, the wafer having a surface on which a photoresist is applied and a peripheral edge provided with a singular shaped point, comprising:

a rotary carrier on which the wafer is placed for rotating the wafer;
an X-Y carrier for moving the rotary carrier parallel to the wafer surface and, simultaneously, in orthogonally intersecting directions;
a sensor for determining a position in which the wafer is placed on the rotary carrier, a position of the singular shaped point of the wafer and the positions of alignment marks recorded on the wafer;
a control means for, on the basis of an output of the sensor, driving the X-Y carrier and simultaneously rotating the rotary carrier, said control means controlling the position of the rotary carrier and its angle of rotation to stipulated values;
a first exit part for the exposure light which is located at a first station for radiating exposure light onto the wafer positioned on the rotary carrier which is moved by the X-Y carrier in orthogonally intersecting directions so as to expose the peripheral area of the wafer in a step shape;
and
a second exit part for the exposure light which is located at a second station for radiating the exposure light onto the wafer positioned on the rotary carrier, wherein said rotary carrier rotates and moves according to an edge position of the wafer in its radial direction so as to expose the peripheral area of the wafer in a ring shape.

4 more elements

Dependencies are inferred from the claim text.