US 5,880,816 AGranted

Process for exposing the peripheral area of a semiconductor wafer for removing unnecessary resist on the semiconductor wafer and a device for executing the process

AssigneeUshiodenki Kabushiki Kaisha

InventorsYoshiki Mimura, Takeshi Minobe, Shinetsu Miura

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Abstract

To effect exposure of the peripheral area of a wafer to remove an unnecessary resist with a step shape in a development process with high precision and ease, even if the position has errors, in which a circuit pattern is formed on a semiconductor wafer in a preceding process, according to the invention, before exposing the unnecessary resist on a wafer outside of the area on which a pattern is formed, the position of a singular shaped area, such as an "orientation flat" or the like is determined by a unit for determining the peripheral edge area of the wafer, and the rotating carrier is driven and the wafer is rotated until the singular shaped area is positioned in a predetermined position. Furthermore, according to the invention, a unit for determining the alignment marks computes and stores the positions of predetermined alignment marks, by which positional errors in the location in which the circuit pattern is formed are corrected. Then, the rotating carrier is driven again, and fine adjustment of the position of the exposure area on the wafer is performed.

Claims4

Dependent claims

Device for exposing a peripheral area of a semiconductor wafer having a peripheral edge area which is provided with a singular shaped area and having a surface on which a photoresist has been applied and a pattern formed, said surface having unnecessary resist outside an area in which the pattern is formed, comprising:

a rotating carrier for fixing said wafer;
a rotating carrier drive means for rotating said rotating carrier;
an angle of rotation reading means for determining an angle of rotation of the rotating carrier;
a light source part for emitting exposure light;
optical fibers having an exit part for irradiating a peripheral edge area of the surface of the wafer on which the photoresist has been applied with exposure light from the light source part;
an observation means for observing the location of alignment marks on said surface of the wafer, said alignment marks having a predetermined positional relationship relative to the pattern on said surface of the wafer;
a means for determining the peripheral edge area, which determines positional information relative to the location of the peripheral edge area of the wafer;
a drive means for driving the exit part of the optical fibers and the observation means in two orthogonally intersecting directions on the same side of the wafer;
and
a control element which controls said drive means for moving the retaining means in said two orthogonally intersecting directions, and which causes the unnecessary resist outside the area on the wafer in which the pattern is formed to be exposed to exposure light radiated from the exit part based upon the location of the alignment marks determined by said observation means and the location of the peripheral edge area determined by said means for determining.

7 more elements

a rotating carrier for fixing said wafer;
a rotating carrier drive means for rotating said rotating carrier;
an angle of rotation reading means for determining an angle of rotation of the rotating carrier;
a means for driving the rotating carrier in two orthogonally intersecting directions;
a means for determining orthogonal positions which determines positions of the rotating carrier in said orthogonal directions;
a light source part for emitting exposure light;
optical fibers having an exit part for irradiating a peripheral edge area of the surface of the wafer on which the photoresist has been applied with exposure light from the light source part;
an observation means for observing the location of alignment marks on said surface of the wafer, said alignment marks having a predetermined positional relationship relative to the pattern on said surface of the wafer;
a means for determining the peripheral edge area, which determines positional information relative to the location of the peripheral edge area of the wafer;
and
a control element which controls said means for driving for moving the rotating carrier in said two orthogonally intersecting directions, and which causes the unnecessary resist outside the area on the above described wafer in which the pattern is formed to be exposed to said exposure light based upon the location of the alignment marks determined by said observation means and the location of the peripheral edge area determined by said means for determining.

8 more elements

Dependencies are inferred from the claim text.