G03F 7/0755
Non-macromolecular compounds containing si-o, si-c or si-n bonds
Official title: {Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds (G03F7/0752 takes precedence)}
G03F7/0755 (Non-macromolecular compounds containing si-o, si-c or si-n bonds) appears on 408 US grants and 490 published applications in this corpus.
Search patents in G03F- Granted patents
- 408
- Published applications
- 490
- Assignees
- 227
- Inventors
- 1,298
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 5 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 7 | 0 |
| 1990 | 6 | 0 |
| 1991 | 3 | 0 |
| 1992 | 10 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 6 | 0 |
| 1996 | 1 | 0 |
| 1997 | 5 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 7 | 0 |
| 2001 | 8 | 1 |
| 2002 | 8 | 9 |
| 2003 | 3 | 14 |
| 2004 | 8 | 12 |
| 2005 | 8 | 6 |
| 2006 | 8 | 9 |
| 2007 | 7 | 17 |
| 2008 | 4 | 8 |
| 2009 | 5 | 14 |
| 2010 | 6 | 9 |
| 2011 | 8 | 18 |
| 2012 | 7 | 15 |
| 2013 | 11 | 20 |
| 2014 | 21 | 22 |
| 2015 | 20 | 37 |
| 2016 | 25 | 14 |
| 2017 | 20 | 20 |
| 2018 | 13 | 24 |
| 2019 | 20 | 28 |
| 2020 | 14 | 23 |
| 2021 | 23 | 35 |
| 2022 | 18 | 33 |
| 2023 | 18 | 17 |
| 2024 | 23 | 27 |
| 2025 | 17 | 21 |
| 2026 | 11 | 37 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Hybrid method of forming microstructure array molds, methods of making microstructure arrays, and methods of use15 Sep 2026US 12,734,730 B2Panther Life Sciences Corporation
- Semiconductor photoresist composition and method of forming patterns using the composition25 Aug 2026US 12,717,228 B2Samsung SDI.Co., Ltd.
- Method for producing display device, and display device21 Jul 2026US 12,690,378 B2Sharp Kabushiki Kaisha
- Curable resin composition for silicon-containing resist, pattern forming method, method for producing imprint mold, and method for producing semiconductor device30 Jun 2026US 12,669,749 B2Dai Nippon Printing Co.Ltd.
- Silanol-containing organic-inorganic hybrid coatings for high resolution patterning7 Apr 2026US 12,596,304 B2Pibond Oy
- Photosensitive resin composition, photosensitive element, printed wiring board, and method for manufacturing printed wiring board3 Sep 2026US 2026/0259499 A1
- Compositions, dielectric materials, electronic devices, and methods of forming the same27 Aug 2026US 2026/0255772 A1Corning Incorporated
- Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, and pattern formation method6 Aug 2026US 2026/0227693 A1Shin-Etsu Chemical Co., Ltd.
- Soluble polymer compound, method for producing soluble polymer compound, resin composition, resin composition film, cured film, and electronic component23 Jul 2026US 2026/0211329 A1Toray Industries, Inc.
- Photosensitive resin composition, resin film having pattern and method for producing same, and semiconductor circuit board16 Jul 2026US 2026/0202742 A1Jsr Corporation
Most cited
By later US patents
- Fluorone and pyronin y derivatives126US 5,451,343 ASpectra Group Limited, Inc. · 1995
- Vapor phase photoresist silylation process122US 4,808,511 AInternational Business Machines Corporation · 1989
- Photoresist pattern fabrication employing chemically amplified metalized material86US 4,921,778 AShipley Company, L.L.C. · 1990
- Pattern forming process and thin-film magnetic head formed by said process76US 4,863,557 A1989
- Silicon-containing photoresist for lithography74US 9,857,684 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018