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US 2026/0227693 A1Published application
Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, and pattern formation method
AssigneeShin-Etsu Chemical Co., Ltd.
InventorHitoshi Maruyama
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Abstract
The photosensitive resin composition comprises (A) a silicone resin having an acid-crosslinkable group, (B) an epoxy compound represented by formula (B1), and (C) a photoacid generator. In formula (B1), R1 is a hydrogen atom, a C1-4 saturated hydrocarbyl group, a phenyl group, a hydroxyphenyl group, or a halogen-substituted phenyl group.
Claims14
A photosensitive resin composition comprising:
- (A) an acid-crosslinkable group-containing silicone resin,
- (B) an epoxy compound of formula (B1) below
- (wherein R1 is a hydrogen atom, a saturated hydrocarbyl group of 1 to 4 carbon atoms, a phenyl group, a hydroxyphenyl group or a halogen-substituted phenyl group), and
- (C) a photoacid generator.
1 more element
Dependencies are inferred from the claim text.