Curable resin composition for silicon-containing resist, pattern forming method, method for producing imprint mold, and method for producing semiconductor device
AssigneeDai Nippon Printing Co., Ltd.
InventorsYasuhiro Okawa, Shintaro Nasu, Masakazu Kaneko, Hirokazu Oda
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Abstract
A curable resin composition for silicon-containing resist including a polymerizable compound, and a polymerization initiator, wherein the polymerizable compound includes a siloxane bond in a molecule, and includes at least one polymerizable functional group; and a ratio of oxygen atoms bonded to a single silicon atom, among oxygen atoms bonded to a silicon atom included in the polymerizable compound, is 10 mol % or less; and the curable resin composition for silicon-containing resist does not contain a solvent, and a viscosity is 20 cPs or less.
Claims11
A curable resin composition for silicon-containing resist comprising a polymerizable compound, and a polymerization initiator,
- wherein the polymerizable compound includes a siloxane bond in a molecule, and includes at least one polymerizable functional group;
- and
- a ratio of oxygen atoms bonded to a single silicon atom, among oxygen atoms bonded to a silicon atom included in the polymerizable compound, is 10 mol % or less;
- and
- the curable resin composition for silicon-containing resist does not contain a solvent, and a viscosity of the curable resin composition is 20 cPs or less.
Dependencies are inferred from the claim text.