F27B 17/0025
Specially adapted for treating semiconductor wafers
Official title: {specially adapted for treating semiconductor wafers}
F27B17/0025 (Specially adapted for treating semiconductor wafers) appears on 469 US grants and 560 published applications in this corpus.
Search patents in F27B- Granted patents
- 469
- Published applications
- 560
- Assignees
- 194
- Inventors
- 1,254
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 5 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 11 | 0 |
| 1991 | 9 | 0 |
| 1992 | 7 | 0 |
| 1993 | 7 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 5 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 0 | 0 |
| 2000 | 5 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 4 |
| 2003 | 2 | 3 |
| 2004 | 14 | 25 |
| 2005 | 10 | 29 |
| 2006 | 24 | 30 |
| 2007 | 8 | 26 |
| 2008 | 16 | 39 |
| 2009 | 11 | 24 |
| 2010 | 26 | 25 |
| 2011 | 19 | 15 |
| 2012 | 24 | 38 |
| 2013 | 20 | 29 |
| 2014 | 17 | 17 |
| 2015 | 23 | 21 |
| 2016 | 17 | 28 |
| 2017 | 28 | 10 |
| 2018 | 12 | 9 |
| 2019 | 12 | 8 |
| 2020 | 9 | 9 |
| 2021 | 8 | 27 |
| 2022 | 8 | 34 |
| 2023 | 17 | 27 |
| 2024 | 25 | 29 |
| 2025 | 29 | 26 |
| 2026 | 10 | 28 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor high pressure annealing device25 Aug 2026US 12,721,088 B2Tokyo Electron Limited
- Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus and non-transitory computer-readable recording medium25 Aug 2026US 12,721,093 B2Kokusai Electric Corporation
- High pressure heat treatment apparatus4 Aug 2026US 12,698,939 B2HPSP Co., Ltd.
- Chilling unit, heat treatment apparatus including same, and heat treatment method7 Apr 2026US 12,595,965 B2Semes Co., Ltd.
- Substrate processing apparatus and substrate processing method17 Mar 2026US 12,578,650 B2Tokyo Electron Limited
- Heat treatment apparatus and heat treatment method1 Oct 2026US 2026/0298540 A1Tokyo Electron Limited
- Heater plate with different emissivity for temperature uniformity17 Sep 2026US 2026/0282805 A1ASM IP Holding B. V.
- Sealing structure for furnace tube, and furnace tube10 Sep 2026US 2026/0266548 A1Changzhou S.C Exact Equipment Co., Ltd.
- Ovens for equipment such as die attach systems, flip chip bonding systems, clip attach systems, and related methods6 Aug 2026US 2026/0225171 A1Kulicke and Soffa Industries, Inc.
- Temperature control apparatus, temperature control method, temperature control program, and wafer manufacturing apparatus30 Jul 2026US 2026/0218414 A1Epicrew Corporation
Most cited
By later US patents
- Movable core fast cool-down furnace577US 4,753,192 ABTU Engineering Corporation · 1988
- Thermal process station with heated lid553US 6,884,066 B2FSI International, Inc. · 2005
- Susceptor heater shim529US 9,202,727 B2ASM IP Holding B. V. · 2015
- Substrate heat treatment apparatus491US 7,432,476 B2Dainippon Screen Mfg.Co., Ltd. · 2008
- Apparatus and method for pre-baking substrate upstream of process chamber476US 9,349,620 B2ASM IP Holdings B.V. · 2016