Substrate processing apparatus and substrate processing method

A substrate processing method including performing a heat treatment on a substrate having a film formed thereon,

• wherein the performing of the heat treatment on the substrate comprises:
• heating the substrate covered with a chamber by placing the substrate on a hot plate of a heating device;
• evacuating, by a peripheral exhaust device, gas in a processing space within the chamber from an outer peripheral region outside a periphery of the substrate supported by the hot plate;
• and
• discharging a gas toward a surface of the substrate from multiple discharge holes distributed along a surface facing the substrate supported by the hot plate, and
• wherein the substrate processing method further comprises, after heating of the substrate by the hot plate has started and after a preset period has elapsed, increasing an exhaust amount in the evacuating of gas in the processing space by adjusting an opening degree of a valve of the peripheral exhaust device while performing the evacuating of gas in the processing space and the discharging of the gas simultaneously.