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US 12,595,965 B2Granted
Chilling unit, heat treatment apparatus including same, and heat treatment method
AssigneeSemes Co., Ltd.
InventorsYoung Jun Son, Young Jun Lee, Ki Sang Eum, Tae Hoon Lee
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Abstract
Proposed are a chilling unit, a heat treatment apparatus including same, and a heat treatment method. More particularly, proposed is a technology capable of rapidly and effectively lowering the temperature of a heating plate by bringing a heat exchange medium of a chilling unit into contact with the heating plate and then circulating a refrigerant after performing a heat treatment process of a substrate through a heat treatment apparatus.
Claims15
A heat treatment apparatus comprising:
- a chilling unit comprising:
- a chilling plate configured to be moved toward a heating plate of a heating unit configured to perform a heat treatment process on a substrate;
- a refrigerant flow path provided in the chilling plate and configured to allow a refrigerant to flow therethrough;
- and
- a heat exchange medium configured to cool the heating plate in contact with at least a portion of the heating plate through heat exchange between the heating plate and the refrigerant in the refrigerant flow path,
- wherein the heat exchange medium comprises a cooling pin disposed on a lower surface of the chilling plate and having a predetermined level of thermal conductivity.
3 more elements
Dependencies are inferred from the claim text.